Au Optronics Corporation

Jiin-Jou Lih

Chih-Feng Sung

Chun-Huai Li

Chih-Hung Su

An encapsulation structure of organic electroluminescence device (OELD) is provided. The encapsulation structure comprises a substrate, an OELD, a soft protection layer, a moisture absorption layer and a rigid protective layer. The OELD is disposed over the substrate. The soft protection layer is disposed over the substrate, and encloses the OELD. The moisture absorption layer encloses the soft protection layer. The rigid protective layer encloses the moisture absorption layer.

Encapsulation structure of organic electroluminescence device

An active-matrix organic light emitting diode display. The active-matrix organic light emitting diode display comprises an organic light emitting diode, a first driving transistor, a second driving transistor and a switch transistor. The switch transistor connects and switches the first and second driving transistors. The first driving transistor connects an anode of the organic light emitting diode and a first driving voltage having a first waveform. The second driving transistor connects an anode of the organic light emitting diode and a second driving voltage having a second waveform, wherein the first waveform and the second waveform are complementary to alternatively drive the organic light emitting diode.

Active-matrix organic light emitting diode display

A driving method is used for driving the voltage-driven circuit of an organic light emitting diode display device. Within a frame period, data voltage is set to a negative data voltage for a pre-defined interval within a frame period. When the scanning voltage is set to a high voltage level, the negative data voltage is applied to the gate terminal of a driving thin film transistor. The gate remains at the negative gate voltage for a maintenance period and the driving thin film transistor has a constant threshold voltage. Hence, this invention provides a mechanism for maintaining a constant luminance from the organic light emitting diode despite an extended use, thus effectively increasing the working life of the display device.

Method of driving display device

A method of fabricating an active matrix organic light emitting diode display is described. A substrate having a light-emitting region and a non-light-emitting region thereon is provided, and pixel structures have been formed in the light-emitting region. A driving IC is formed on the substrate in the non-emitting region and electrically coupled with the pixel structures. A packaging cap is disposed over the substrate and adhered to the substrate. The packaging cap covers the emitting region of the substrate and the driving IC remains being exposed. Since the driving IC is exposed from the packaging cap, the driving IC can be tested or repaired directly when the driving IC is abnormal.

Display of active matrix organic light emitting diode and fabricating method

n active matrix organic light emitting diode display and a fabrication method of the same. A substrate having a display area and a non-display area is provided. A plurality of pixel structures is formed in the display area, and a plurality of transparent conductive lines to electrically connect the pixel structures are formed on the substrate. The transparent conductive lines extend from the display area to the non-display area. A photosensitive glue is formed at a periphery of the display area, and a cap is formed to cover the display area. The cap is adhered to the substrate using the photosensitive glue. A radiation step is performed on a rear surface of the substrate to cure the photosensitive glue. A driving chip electrically connected to the pixel structures via the transparent conductive lines is formed in the non-display area.

Active matrix organic light emitting diode display and fabrication method of the same

An active matrix organic light emitting diode display and a fabrication method of the same. A substrate having a display area and a non-display area is provided. A plurality of pixel structures is formed in the display area, and a plurality of transparent conductive lines to electrically connect the pixel structures are formed on the substrate. The transparent conductive lines extend from the display area to the non-display area. A photosensitive glue is formed at a periphery of the display area, and a cap is formed to cover the display area. The cap is adhered to the substrate using the photosensitive glue. A radiation step is performed on a rear surface of the substrate to cure the photosensitive glue. A driving chip electrically connected to the pixel structures via the transparent conductive lines is formed in the non-display area.

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Taichung, Taiwan

Jiin-Jou Lih