Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Lg Electronics Inc.

Seoul National University

Postech Academy-industry Foundation

Hyundai Motor Company

Kia Motors Corporation

Hd Hyundai Infracore Co., Ltd.

Institute for Basic Science

I-sens, Inc.

Qualcomm Incorporated

Samsung Sdi Co., Inc.

Kia Corporation

Doosan Infracore Co., Ltd.

Versum Materials Us, LLC

Jihoon Kim

Hyoseok Na

Jiyong Kim

Jongin Lee

Taehun Kim

Hyuekjae Lee

Jiyoon Lee

Junghoon Lee

Sunghyun Choi

Youngmin Kim

Kangjin Yoon

Byounghoon Jung

Sanghun Park

Jihwan Hwang

Jin-gyu Seo

Jihwan Suh

Junghoon Han

Junghoon Kim

Juho Son

Won Jong Kim

Byungjoon Park

Youngchang Yoon

Donghyuk Lee

Jihyun Lee

Seung-Hoon Park

Sanghoon Lee

Jungsoo Jung

Jongho Lee

Yeunwook Lim

Hyunseok Choi

Hakhyun Nam

Geun Sig Cha

Namjun Cho

Jooseung Kim

Woojin Choi

Bumman Kim

Jiseok Hong

Dohyeon Kim

Ji-seok Hong

Sungwoo Sul

Junghwan Son

Sangcheon Park

Taewon Kwak

Daehyun Kang

Soowon Kim

Hyungtae Kim

Seongwook Ji

Dong Hoon Lee

Sangho Lee

Yong Uk Shin

Kyungmin Kim

Junho Lee

Byounguk Yoon

Youngmin Lee

Chon Ok Kim

Seunghoon Park

Hyu Tae Shim

Hee-Seok Lee

Yongmin Kim

Sehwan Park

Heecheul Moon

Woochurl Son

Jeong Ho Park

Minho Chae

Il Ho Lee

Jungwoo Lee

Yonghoon Kim

Junho Park

Haeshin Lee

Woong Bae Kim

Wangwoo Lee

Ki Dong Kim

Jonghwan Lee

Jinho Lim

Sewan Son

Walter Jun

Junghwa Kim

Minwoo Woo

Wonil Lee

Dong Keun Han

Wonchul Lee

Jaeyong Lee

Yongjun An

Sungjoo Kim

Jihoon Lee

Jeong Kwon Park

Gwangjae Jeon

Hyunchul Park

Seungwoo Yoo

Minki Kim

Dongkyu Park

Eunji Choi

Taejun Park

Kyo-Suk Chae

Minsu Lee

Jongbae Kim

Sunho Hwang

Junho Sim

Kyuhwan An

Jinwon Lee

A display device according to an embodiment of the present disclosure may comprise: a roller accommodated in the housing; a display configured to be withdrawn from or retracted into the housing by operating the roller; and a control unit configured to control the roller such that a screen of the display is formed to face at least one of a first direction and a second direction.

Display device

A 5th generation (5G) or pre-5G communication system for supporting a higher data rate than previous 4th generation (4G) communication systems is provided. A switching circuit in a wireless communication system is provided. The switching circuit includes a first coil, a second coil electrically coupled to the first coil, a first switch electrically connected to the second coil, a third coil electrically coupled to the first coil, a second switch electrically connected to the third coil, and a control unit configured to control the opening or closing of the first switch and the second switch. The control unit can be configured to close the first switch and open the second switch to form a first path using the first coil and the second coil, and open the first switch and close the second switch to form a second path using the first coil and the third coil.

Switching circuit for switching signal path in wireless communication system, and electronic device comprising same

A laundry drying machine includes a cabinet, a drum that is rotatably disposed inside the cabinet and that defines an inner space configured to accommodate a subject to be dried, a driver configured to rotate the drum, a duct configured to supply air to the drum and to discharge the air from the drum, and an electrode part configured to form an electric field in the inner space of the drum to thereby heat the subject. The electrode part includes a probe configured to radiate an electromagnetic wave defining the electric field, where at least a portion of the probe is disposed in the inner space of the drum.

Laundry drying machine

A semiconductor package is provided in which a first insulating layer includes a first recess spaced apart from a first pad in a first direction, and a second insulating layer includes a second recess spaced apart from a second pad in the first direction and overlapping at least a portion of the first recess in a second direction, perpendicular to the first direction, to provide an air gap together with the first recess. The semiconductor package further includes a first bonding surface defined by the first and second insulating layers contacting each other on one side of the air gap, adjacent to the first and second pads, and a second bonding surface defined by the first and second insulating layers contacting each other on another side of the air gap, opposite to the one side.

Semiconductor package, and method of manufacturing the same

A display apparatus including: a display panel including an emission line and a pixel electrically connected to the emission line; an emission driver configured to output an emission signal to the emission line; and a driving controller configured to determine a light emission cycle, wherein the light emission cycle is a number of light emissions in a single frame of the emission signal, wherein the driving controller is configured to determine a luminance according to a user luminance setting and a grayscale value of input image data, to determine the light emission cycle corresponding to a range of the luminance and to determine an off ratio according to the luminance, wherein the off ratio is a ratio of turned-off gate lines to a total number of the gate lines.

Display apparatus and a method of driving a display panel using the same

A display device includes a display panel including a display area including a light blocking area and a non-display area around the display area, a base film disposed on the display panel, a light blocking layer that overlaps the light blocking area and is disposed on a surface of the base film, a first adhesive disposed between the display panel and the base film, a window disposed on the base film, and a second adhesive disposed between the window and the base film. A first hole defined in a portion of the light blocking area passes through the base film, the light blocking layer, the first adhesive, and the second adhesive.

Display device and method for manufacturing the same

Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device may include a substrate having a groove therein extending in a first direction, a gate insulating layer in the groove, a first conductive pattern in the groove and on the gate insulating layer, and a word line capping pattern in the groove and on the first conductive pattern. The first conductive pattern may include a first material and may include a first conductive portion adjacent to the word line capping pattern and a second conductive portion adjacent to a bottom end of the groove. A largest dimension of a grain of the first material of the first conductive portion may be equal to or larger than that of the first material of the second conductive portion.

Semiconductor device having conductive portions in a groove and contacting a gate insulating layer

A semiconductor package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a peripheral region having a groove and a bonding region that is disposed higher than the groove. The second semiconductor chip is disposed in the bonding region of the first semiconductor chip. The second semiconductor chip is directly electrically connected to the first semiconductor chip. The second semiconductor chip includes an overhang protruded from the bonding region. The overhang is spaced apart from a bottom surface of the groove. Thus, a bonding failure, which may be caused by particles generated during a cutting the wafer and adhered to the edge portion of the second semiconductor chip, between the first semiconductor chip and the second semiconductor chip might be avoided.

Semiconductor package utilizing a hybrid bonding process and method of manufacturing the same

A control system for a construction machine includes a tilt sensor for detecting an inclination angle of the construction machine parked on a slope, a door latch device including a lock/unlock actuator configured to lock/unlock a door of the construction machine according to a door lock control signal and a door unlock control signal and a release actuator configured to release the door according to a door release control signal, and a smart key module configured to output the door unlock control signal and the door release control signal when the inclination angle of the construction machine is within a preset safe range in case that an unlocking event signal is detected while a smart key is recognized.

Control system for construction machine and control method for construction machine

A cover device of an electronic device is provided. The cover device includes a cover housing configured to cover at least a portion of the electronic device in a first state in which the electronic device is electrically coupled to the cover device, and a bracket including a first surface on which a terminal part is disposed and a second surface which faces the cover housing, wherein the bracket includes at least one first magnet disposed adjacent to the first surface and at least one second magnet disposed adjacent to the second surface, the cover housing includes at least one third magnet, and the at least one third magnet is disposed to align with the at least one second magnet in a second state in which the electronic device is electrically isolated from the cover device.

Contact structure for coupling with external electronic device and electronic device including same

According to certain embodiments, an electronic device may include a display, a memory, and a processor operatively connected to the display and the memory. The processor may be configured to, while receiving user's touch input in a handwriting area of the display, the user's touch input comprising successive input stokes: output the successive input strokes in the handwriting area on the display; determine a first stroke group including some of the successive input strokes, to determine a first character corresponding to the first stroke group, to output the first stroke group in an output area adjacent to the handwriting area on the display, to determine a second stroke group including at least another input stroke received after the some of the successive input strokes, to determine a second character corresponding to the second stroke group, and to output the second stroke group in the output area, move the first stroke group to on one side of the second stroke group on the display.

Electronic device and handwriting recognition method

A laundry drying machine includes: a cabinet, a drum disposed inside the cabinet and configured to accommodate a target object, a driving unit configured to rotate the drum, and an electric field generator spaced apart from the drum and configured to generate an electric field inside the drum. The drum includes: a drum body having a cylindrical shape and accommodating the target object, a ground electrode that is in contact with an outer circumferential surface of the drum body, and a support roller that is in contact with the outer circumferential surface and that is configured to, based on the drum body rotating, support the drum body in a direction of the ground electrode, and a shortest distance between a central axis of the support roller and the ground electrode is less than a sum of a diameter of the drum body and a radius of the support roller.

A display device includes a display panel configured to display an image. The display panel includes an electrode layer. An input sensing layer is disposed on the display panel. The input sensing layer includes a plurality of sensing electrodes including a first sensing electrode and a second sensing electrode. A plurality of signal lines is electrically connected to the plurality of sensing electrodes. The plurality of signal lines includes a first signal line electrically connected to the first sensing electrode and a second signal line electrically connected to the second sensing electrode. The first signal line has a length different from a length of the second signal line. A distance between the first signal line and the electrode layer is different from a distance between the second signal line and the electrode layer.

Display device including signal lines

A method of forming a compound structure according to embodiments of the present disclosure comprises loading a metal precursor on a substrate, providing a chalcogen precursor to the substrate, and reacting the chalcogen precursor with the metal precursor. The metal precursor comprises transition metal nanoparticles. The compound structure has a 2-dimensional structure.

Method of forming compound structure with 2-dimensional structure

A semiconductor package includes a first connection structure, a first semiconductor chip on an upper surface of the first connection structure, a first molding layer on the upper surface of the first connection structure and surrounding the first semiconductor chip, a first bond pad on the first semiconductor chip, a first bond insulation layer on the first semiconductor chip and the first molding layer and surrounding the first bond pad, a second bond pad directly contacting the first bond pad, a second bond insulation layer surrounding the second bond pad; and a second semiconductor chip on the second bond pad and the second bond insulation layer.

Packaged multi-chip semiconductor devices and methods of fabricating same

Growing community of inventors

Gyeonggi-do, South Korea

Jihoon Kim