Samsung Electronics Co., Ltd.

Technical Coating Solution Line-x Co., Ltd.

Jiho Jeon

Yongjun Cho

Dongwan Kim

Jeong-Hyun Kim

Yoong Chung

Injun Choi

Seung-Hyeok An

Saya Lee

Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.

Insulation structure, insulated piping device including the same, and method of fabricating the same

Growing community of inventors

Yeosu-si, South Korea

Jiho Jeon