Taiwan Semiconductor Manufacturing Comp. Ltd.

Jien-Ren Chen

Wen-Sheng Wu

Yue-Ying Jian

Wei-Jen Huang

An apparatus for shear testing bonds on 8&#x2033; and 12&#x2033; silicon substrates. The apparatus includes a removable platform for securing the 8&#x2033; wafer and a vacuum chuck for securing a 12&#x2033; wafer and the removable platform at the same time. A control module controls a moving mechanism to shift a probe to contact the solder ball of the 12&#x2033; substrate secured on the vacuum chuck or the solder ball of the 8&#x2033; wafer on the removable platform when the removable platform is fixed on the vacuum chuck. The moving mechanism moves the probe in a direction to separate the solder ball from the wafer. A sensor measures the pulling force exerted on the probe when the probe is moved in a direction and separates the solder ball from the wafer.

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Miaoli, Taiwan

Jien-Ren Chen