Fortemedia, Inc.

Industrial Technology Research Institute

Jien-Ming Chen

Wen-Shan Lin

Nai-Hao Kuo

Feng-Chia Hsu

Chih-Yuan Chen

Hsin-Li Lee

Chun-Kai Mao

Chin-Hung Wang

Chia-Yu Wu

Jing-Yuan Lin

Yu-Sheng Hsieh

Chin-Wen Huang

Chia-Jung Chang

Pin Chang

Tzong-Che Ho

Li-Chi Pan

Chin-Fu Kuo

Chien-Nan Yeh

Di-Bao Wang

Chia-yu Wu

A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.

Micro-electro-mechanical system structure

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, an insulating layer, and a diaphragm. The substrate has an opening portion. The backplate is disposed on a side of the substrate, with protrusions protruding toward the substrate. The diaphragm is movably disposed between the substrate and the backplate and spaced apart from the backplate by a spacing distance. The protrusions are configured to limit the deformation of the diaphragm when air flows through the opening portion.

MEMS microphone

A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.

MEMS structure

A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.

A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.

Mems structure

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a diaphragm, a backplate and a first protrusion. The substrate has an opening portion. The diaphragm is disposed on one side of the substrate and extends across the opening portion of the substrate. The backplate includes a plurality of acoustic holes. The backplate is disposed on one side of the diaphragm. An air gap is formed between the backplate and the diaphragm. The first protrusion extends from the backplate towards the air gap.

A MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, a diaphragm movably disposed between the substrate and the backplate, and a plurality of slots formed on the diaphragm. The slots are spaced apart from each other and have a non-constant width to relieve the residual stress on the diaphragm.

A micro-electro-mechanical system (MEMS) device is provided. The MEMS device includes a substrate, a backplate disposed on a side of the substrate, a diaphragm, and a dynamic valve layer. The substrate forms an opening. The diaphragm is disposed on the side of the substrate and extends across the opening of the substrate, wherein the diaphragm forms a vent hole. The dynamic valve layer is disposed on the side of the substrate and includes a flap portion, wherein the flap portion covers at least a part of the vent hole when viewed in a direction perpendicular to the diaphragm, and the flap portion deforms when air flows through the vent hole.

Mems device with dynamic valve layer

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate disposed on a side of the substrate, and a diaphragm movably disposed between the substrate and the backplate. The diaphragm includes a plurality of implantation portions, and the implantation portions have different concentration-depth profiles.

A tunable optical device including a substrate, at least one support unit, a flexible frame, an elastic component, a first reflector, and at least one actuator is provided. The support unit is fixed onto the substrate. The flexible frame is connected to the support unit and suspended above the substrate. The elastic component is connected to the flexible frame. A stiffness of the elastic component in the Z-axis is smaller than a stiffness of the flexible frame in the Z-axis. The Z-axis direction is parallel to a normal direction of the substrate. The first reflector is connected to the elastic component. The actuator is located between the flexible frame and the substrate or located between the first reflector and the substrate.

Tunable optical device

A MEMS microphone package includes a substrate, a transducer, an integrated circuit chip, and a housing. The substrate has a hollow chamber, a first opening and a second opening, wherein the first opening and the second opening communicate with the hollow chamber. The transducer is disposed on the substrate. The integrated circuit chip is disposed on the substrate. The housing is disposed on the substrate, and covers the integrated circuit chip and the transducer.

Back chamber volume enlargement microphone package

A micro-electro-mechanical system (MEMS) microphone is provided. The MEMS microphone includes a substrate, a backplate, a diaphragm, a first insulating protrusion and a plurality of second insulating protrusions. The backplate is disposed on a side of the substrate. The diaphragm is disposed between the substrate and the backplate and is movable relative to the backplate. The first insulating protrusion and the second insulating protrusions are formed on the side of the backplate facing the diaphragm. The first insulating protrusion is connected to and affixed to the diaphragm permanently, and an air gap is formed between the diaphragm and each of the second insulating protrusions.

MEMS microphone with tunable sensitivity

A pressure sensor and a manufacturing method of the same are provided. The pressure sensor includes a substrate, a dielectric oxide layer, a first electrode, a dielectric connection layer, and a second electrode. The dielectric oxide layer is formed on the substrate. The first electrode is formed on the dielectric oxide layer. The dielectric connection layer is formed on the first electrode. The second electrode is formed on the dielectric connection layer. The second electrode comprises a patterned conductive layer and a dielectric layer. The patterned conductive layer has a plurality of holes, and the dielectric layer is formed on the patterned conductive layer and covers the inner walls of the plurality of holes. The first electrode, the dielectric connection layer, and the second electrode define a first chamber between the first electrode and the second electrode.

Pressure sensor and manufacturing method of the same

A MEMS acoustic transducer is provided, which includes a substrate, a MEMS chip, and a housing. The substrate has a first opening area and a lower electrode layer disposed over a surface of the substrate, wherein the first opening area includes at least one hole allowing acoustic pressure to enter the MEMS acoustic transducer. The MEMS chip is disposed over the surface of the substrate, including a second opening area and an upper electrode layer partially sealing the second opening area, wherein the upper electrode layer and the lower electrode layer, which are parallel to each other and have a gap therebetween, form an induction capacitor. The housing is disposed over the MEMS chip or the surface of the substrate creating a cavity with the MEMS chip or the substrate. In addition, a method for fabricating the above MEMS acoustic transducer is also provided.

MEMS acoustic transducer and method for fabricating the same

A capacitive transducer and manufacturing method thereof is provided. A multifunction device including a plurality of the capacitive transducers is also provided, where the capacitive transducers are disposed on a substrate and include at least one microphone and at least one pressure sensor or ultrasonic device.

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Tainan, Taiwan

Jien-Ming Chen