Infinera Corporation

Alpha Metals (korea) Ltd.

Jie Tang

Donald J Pavinski

David Gerald Coult

Timothy Butrie

Peter Weindel Evans

Mehrdad Ziari

Vikrant Lal

Xiaofeng Han

Michael Reffle

Fred A Kish, Jr

John William Osenbach

Jiaming Zhang

John Coronati

S Eugene Messenger

Radhakrishnan L Nagarajan

James Edward Stewart

Joseph Edward Riska

Huan-Shang Tsai

Gary B Hess

Thomas S Goehring

Mark D Muszynski

Renshan Zhang

Fred A Klsh, Jr

A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.

Low-cost nano-heat pipe

A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

Hybrid optical transmitter and/or receiver structure

A photonic transmitter, comprises a modulator driver having a first and second output ports, a photonic integrated transmitter circuit having a modulator having a first and a second input line, and a first input port electrically coupled with the first input line and a second input port electrically coupled with the second input line, and an interconnect bridge assembly, including a first termination resistor, a second termination resistor, and a substrate. An impedance-controlled transmission structure is formed in the substrate, and has: (a) an impedance control section including a first and a second signal lines electrically insulated from one another; and (b) a transmission section including a third and a fourth signal line coupled with termination resistor. The interconnect bridge assembly transmits an impedance controlled differential electrical signal from the modulator driver to the modulator, and transmits the electrical signal from the modulator to the first and second termination resistors.

Interconnect bridge assembly for photonic integrated circuits

Consistent with the present disclosure, a package is provided that includes a housing having a recessed portion to accommodate an integrated circuit or chip. The housing has an inner periphery that defines or delineates the recessed portion. The inner periphery may be stepped and includes first and second surfaces that are spaced vertically from one another and extend in respective parallel planes, for example, to thereby constitute first and second shelves. First bonding pads or contacts ('housing pads') may be provided on the first surface, which may electrically connect or interconnect with first pads on the integrated circuit ('IC pads'), and second housing pads may be provided on the second surface, which can electrically connect or interconnect with second IC pads. Thus, the IC pads connect to corresponding housing pads on the inner periphery of the housing that are above and below one another. Since the housing pads are not provided on the same surface, the number of housing pads on each step or shelf of the periphery can be reduced, and the housing pads can be spaced from one another by a spacing or pitch that is greater than that of the IC pads. Accordingly, the dimensions and spacing of the housing pads may comply with relevant design rules, while providing connection to an increased number of IC pads.

Two-shelf interconnect

An improved integrated circuit (IC) layout is described that provides conductive pads on opposite sides of a substrate. The conductive pads provide for connectivity to the chip in different chip orientations. Accordingly, multiple chips having the same layout can be provided in a package, instead of providing each chip with a different layout. Since the same layout may be used for each chip, manufacturing costs are reduced.

Integrated circuit with pins at multiple edges of a chip

Uniform sized and shaped spheres are formed by applying a minute periodic disturbance to a low viscosity liquid material. Pressure forces the material through at least one orifice in a crucible as a steady laminar stream. The stream enters an enclosed controlled temperature solidification environment which contains at least one heat transfer medium. A charging means is applied to the stream as the stream exits the crucible and breaks into a plurality of spheres to deflect the spheres as they pass through an electric field. The enclosed controlled temperature solidification environment cools and substantially solidifies the spheres.

Apparatus and method for making uniformly sized and shaped spheres

Growing community of inventors

Fogelsville, PA, United States of America

Jie Tang