National University of Singapore

Nanyang Technological University

Delta Electronics Int'l (singapore) Pte Ltd

Jie Song

Lay-Lay Chua

Kian Ping Loh

Peter Ho

Beng Beng Lim

Rui-Qi Png

Xiaofeng Xu

Loke-Yuen Wong

Jing-Mei Zhuo

Geok Kieng Lim

Wing Keung Law

Fong Yu Kam

Geok-Kieng Lim

A package structure includes a first encapsulation member, a second encapsulation member, at least one semiconductor chip, a plurality of metal pins and a second insulation layer. The first encapsulation member includes a first metal layer, a first insulation layer and a second metal layer. The at least one semiconductor chip is disposed between the first encapsulation member and the second encapsulation member. The at least one semiconductor chip comprises a plurality of conductive terminals connected with the first metal layer or a third metal layer. The plurality of metal pins are disposed between and extended outward from the first encapsulation member and the second encapsulation member. The second insulation layer is disposed between the first encapsulation member and the second encapsulation layer for securing the first encapsulation member, the second encapsulation member, the at least one semiconductor chip, and the plurality of metal pins.

Heat-dissipating semiconductor package including a plurality of metal pins between first and second encapsulation members

A system includes a first fluid inlet and a single reverse osmosis membrane module having a permeate outlet and a first inlet/outlet channel and a second fluid inlet/outlet channel in fluid communication with the first fluid inlet. An energy transfer system has a second fluid inlet, a brine outlet, a first energy exchanging module and a second energy exchanging module. The first and second energy exchanging modules are adapted to reversibly operate in opposite flow phases where a flow direction for the expulsion flow phase in each energy exchanging module is constant and where a flow direction for the energy recover flow phase in each energy exchanging module is constant. The single reverse osmosis membrane module is adapted to reversibly receive a feed flow through one of the first and second fluid inlet/outlet channels and produce a brine outflow through the other of the first and second inlet/outlet channels.

Integrated reverse osmosis module with energy recovery for desalination

The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.

Method of transferring thin film

Growing community of inventors

Singapore, Singapore

Jie Song