Taiwan Semiconductor Manufacturing Comp. Ltd.

Jie Shing Wu

Wen-Cheng Chang

Sen Fu Chen

Po-Tau Chu

A protective cap of dielectric material is deposited by plasma-enhanced chemical vapor deposition on the surface of electrical bonding pads of semiconductor integrated circuits prior to deposition of the final passivation layer. The protective cap serves to isolate the pad surface from electrochemical or other interaction with the etching solution used to open contact holes through the passivation layer. This prevents the formation of surface damage and residues on the pad which lead to yield and reliability problem with integrated circuits.

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Hsin-Chu, Taiwan

Jie Shing Wu