Asm Technology Singapore Pte Ltd

National University of Singapore

Jie Liu

Shu Chuen Ho

Teng Hock Kuah

Seow Kiang Khoo

Dawei Xing

Hong Wei Guan

Yue Gen Yu

Bin Liu

See Yap Ong

Si Liang Lu

Man Ho Hui

Zhen Huang

Chin Guan Ong

Disclosed herein is a donor-acceptor-donor (D-A-D) compound of formula I, where in the acceptors are mono-substituted tetraphenylethylene moieties. Also disclosed herein are fluorescent nanodots that comprise the compound of formula (I) and uses of said compound or nanodots in in vivo imaging or detecting of cancer cells in a subject.

Methods and compositions for near infrared fluorescent nanodots with aggregation-induced emission characteristics

Disclosed is a method of manufacturing a lead frame, which comprises the steps of: providing an electrically-conductive base material having first and second planar sides; forming a plurality of conductive contact points on the first planar side of the base material; providing a non-conductive filling material over the first planar side of the base material so that the filling material fills spaces in-between the plurality of contact points to a form a layer comprising the filling material and the plurality of contact points; and etching the second planar side of the base material to expose a pattern of the filling material from the second planar side of the base material and to thereby form a plurality of isolated conductive regions on the second planar side of the base material, each isolated conductive region being connected with at least a respective one of the plurality of contact points on the first planar side of the base material. A lead frame structure is also disclosed.

Lead frame and a method of fabrication thereof

A method of manufacturing a lead frame, comprising the steps of: providing an electrically-conductive base material having first and second planar sides; forming a patterned conductive layer on the first planar side of the base material; etching the second planar side of the base material at portions with respect to exposed portions on the first planar side of the base material comprising the patterned conductive layer, to form partially-etched portions on the second planar side of the base material; providing a non-conductive filling material over the second planar side of the base material, wherein the filling material fills spaces inside the partially-etched portions on the second planar side of the base material to form adjacent portions of the filling material and a plurality of conductive portions on the second planar side of the base material; and etching the exposed portions of the first planar side of the base material comprising the patterned conductive layer to form partially-etched portions on the first planar side of the base material that combine with the partially-etched portions on the second planar side of the base material to thereby form a plurality of separate conductive regions on the first planar side of the base material, each conductive region being electrically conductive with at least a respective one of the plurality of conductive portions on the second planar side of the base material.

Lead frame and a method of manufacturing thereof

The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.

Sectional molding system

A feeding system () for epoxy mould compound (EMC) pellets which has a supply bowl () situated outside the clean environment () of a conventional automatic moulding machine (). A tube () extends from the supply bowl () to a buffer hopper () within the clean environment and which is located above the feeder bowl () of the automatic moulding machine (). EMC pellets are transported through the tube () from the supply bowl () into the buffer hopper () via a vacuum suction system (), () which is connected to the tube () in proximity to the buffer hopper (). A counter air flow may be provided to slow the speed of the pellets as they enter the buffer hopper. Batches of the pellets accumulated in the buffer hopper () are periodically released into the feeder bowl () of the automatic moulding machine (). The vacuum transportation system reduces dust from the pellets. Also productivity is increased compared to conventional use of the automatic moulding machine () by providing for the supply bowl () to have a significantly larger capacity compared to the feeder bowl () of the automatic moulding machine ().

Pellet feeding system for a molding machine

Mold cleaning apparatus ( ) includes a manifold ( ) adapted to be coupled to a suction device. A first conduit ( ) extends from the manifold ( ) and has a first opening ( ) remote from the manifold. A second conduit ( ) extends from the manifold ( ) and has a second opening ( ) remote from the manifold ( ). The first and the second openings ( ) being directed in opposite directions, and the first conduit ( ) having a section ( ) with a cross-sectional area which is less than cross-sectional area at any point along the length of the second conduit ( ).

Mold cleaning apparatus

Molding apparatus ( ) is provided for simultaneously molding a molding material around a number of separate substrates, each substrate having a semiconductor chip mounted thereon. The apparatus includes a mold holder ( ) having a first holding section for holding a first mold half ( ) and a second holding section for holding a second mold half ( ). The first and second holding sections have a common support surface ( ), the support surface ( ) including a first movable member ( ) in the first holding section and a second movable member ( ) in the second holding section. The first and second movable members ( ) are movable between a first position in which they protrude out of the support surface ( ) and a second position in which the protrusion from the support surface ( ) is less than in the first position. A first drive mechanism ( ) is coupled to the first movable member ( ) and a second drive mechanism ( ) is coupled to the second movable member ( ). The first and second drive mechanisms ( ) are adapted to be independently actuated to move the first and second movable members ( ) between the first and second positions.

Growing community of inventors

Singapore, Singapore

Jie Liu