Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hefei Boe Ruisheng Technology Co., Ltd.

Hefei Xinsheng Optoelectronics Co., Ltd.

Jie Lei

Zouming Xu

Jian Tian

Chunjian Liu

Xintao Wu

Jie Wang

Jianying Zhang

Qin Zeng

Zhi Zhang

Yongfei Li

Tianqing Liu

Min He

Xiaodong Xie

Haifeng Hu

Xiaofeng Yin

Feifei Wang

Qingpu Wang

Huan Liu

Tsungchieh Kuo

Yu Jiang

Jiawei Xu

Xinxiu Zhang

Qitao Zheng

Xue Liang Zhao

Li Yin

Wenjie Xu

Huayu Sang

Xiaohui Yang

Liuyue Yin

Zhenzhong Fang

Yajun Ma

Zhentao Li

Mengmeng Li

Zhi Jin

Chuanwen Zhang

Jiacheng Ding

Shaoyi Zhan

Yufei Zhan

Yuancheng Li

The present disclosure provides a light-emitting substrate, a method for manufacturing the same, and a display device. The light-emitting substrate includes: a substrate including a light-emitting region; a first conductor on the substrate and at least in the light-emitting region, the first conductor extending along a first direction in the light-emitting region; a second conductor on the first conductor and arranged in the light-emitting region, the second conductor including a first connecting portion; and a first insulator within the light-emitting region. The first connecting portion extends along a second direction, an orthographic projection of the first connecting portion on the substrate at least partially overlaps with an orthographic projection of the first conductor on the substrate to constitute an overlapping region. The first insulator is only between the first connecting portion and the first conductor, the overlapping region is within an orthographic projection of the first insulator on the substrate.

Light-emitting substrate, method for manufacturing the same, and display device

Disclosed are a drive backplane, a preparation method therefor, and a display apparatus. The drive backplane includes a substrate, wherein the substrate includes a light emitting region and a bonding region, the light emitting region includes light emitting units arranged in an array, each light emitting unit includes a first signal line and a pad electrically connected with the first signal line; a first conductive layer, which is disposed on one side of the substrate and includes a first signal line and at least one signal detection line; and a second conductive layer, which is disposed on one side of the first conductive layer facing away from the substrate and includes: a pad; wherein the signal detection line is electrically connected with the pad of the light emitting unit.

Drive backplane, preparation method therefor, and display apparatus

The present disclosure provides an array substrate and a display device. The array substrate includes a base substrate, a first conductive layer and a second conductive layer, the first conductive layer is provided on one side of the base substrate and includes a first conductive portion; the second conductive layer is provided on one side of the first conductive layer away from the base substrate and includes a second conductive portion; the projection of at least part of the second conductive portion on the base substrate and the projection of the first conductive portion on the base substrate do not overlap.

Array substrate and display device for mini-LED

A light-emitting substrate has a light-emitting region and a test region. A plurality of light-emitting device groups and a plurality of driving circuits are disposed in the light-emitting region. The driving circuits include at least one selected driving circuit, and a selected driving circuit includes at least one first-type output terminal and at least one second-type output terminal. The first-type output terminal is electrically connected to the light-emitting device group. A power line is electrically connected to the light-emitting device groups. A first test pad and a second test pad are disposed in the test region. The first test pad is electrically connected to a second-type output terminal of the selected driving circuit, and the second test pad is electrically connected to the power line. The first test device group is electrically connected to the first test pad and the second test pad.

Light-emitting substrate, backlight module and display device

A light-emitting substrate and a display apparatus are disclosed, The substrate includes: a base substrate; a base substrate; a first wiring layer on the base substrate including a first signal line and a second signal line; a first insulating layer on a side of a first wiring layer facing away from the base substrate; and a second wiring layer on a side of the first insulating layer facing away from the base substrate. The second wiring layer includes a plurality of first connecting lines and a plurality of second connecting lines. The first signal line includes a plurality of first sub-signal lines extending in a first direction and arranged at intervals. At least one first sub-signal line is coupled with at least one first connecting line, and the second signal line is coupled with at least one second connecting line.

Light-emitting substrate and display apparatus

The present disclosure relates to the field of display, and provides an array substrate, a light-emitting substrate and a display device. The array substrate includes a base substrate, and a first conductive layer and a second conductive layer stacked on and base substrate and insulated from each other. The array substrate also includes a plurality of groups of light-emitting element terminals arranged in an array on the second conductive layer, for connecting to light-emitting elements; and several groups of sensor terminals located on the second conductive layer for connecting to sensors. The sensors are configured to sense the light-emitting elements, so as to quickly and effectively monitor the light-emitting conditions of the surrounding light-emitting elements, and make more precise adjustments in time to various parameters of the light-emitting elements, ensuring the stable performance of each light-emitting element.

Array substrate, light-emitting substrate and display device

An array substrate () and a display device. The array substrate () includes a bonding area (). The array substrate () includes a substrate (), a first conductive layer () on the substrate (), a first insulating layer () on one side of the first conductive layer () away from the substrate (), and a second conductive layer () on one side of the first insulating layer () away from the substrate (). The bonding area () is provided with bonding pins (), and the bonding pin () includes a first conductive portion () and a second conductive portion () located on the side of the first conductive portion () away from the substrate (), the first conductive portion () is located in the first conductive layer (), the second conductive portion () is located in the second conductive layer (), and the first conductive portion () is in direct contact with the second conductive portion (). The first insulating layer () is provided with at least one first opening (), and the orthographic projection of each of the first openings () on the substrate () covers the orthographic projections of the plurality of bonding pins () on the substrate ().

Array substrate and display device

A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.

Wiring substrate, display substrate and display apparatus

A display substrate and a display apparatus are provided. The display substrate includes a base substrate, a first conductive layer, a second conductive layer and an insulation layer. The first conductive layer is on a side of the base substrate and includes a first conductive part extending in a first direction, the second conductive layer is on a side of the first conductive layer facing away from the base substrate, and the insulation layer is located between the first conductive layer and the second conductive layer. At least one first conductive part includes a first hollowed-out portion including a plurality of groove structures distributed in a second direction and extending in the first direction. The first direction and the second direction produce angles.

Display substrate having conductive parts comprise hollowed-out portion

The present disclosure provides a light-emitting substrate, a backlight and a display device. The light-emitting substrate includes a light-emitting region and a peripheral region surrounding the light-emitting region. The peripheral region includes a first area, the first area is located between a first side of the light-emitting substrate and the light-emitting region, the light-emitting substrate further includes a first signal line, the first signal line includes at least one selected from a group consisting of a first portion and a second portion, the first portion of the first signal line extends along a first direction in the first area, the second portion of the first signal line extends into the light-emitting region, the first portion and the second portion of the first signal line are connected when the first signal line includes the first portion and the second portion.

Light-emitting substrate, backlight, display device

A backplane, a backlight source, an illumination device and a displaying device. The backplane comprises a substrate; a first metal trace layer disposed on one surface of the substrate; an insulating layer disposed on a side, away from the substrate, of the first metal trace layer; a second metal trace layer disposed on a side, away from the substrate, of the insulating layer, an overlapping area existing between an orthographic projection of the second metal trace layer on the substrate and an orthographic projection of the first metal trace layer on the substrate; and a barrier layer disposed between the first metal trace layer and the second metal trace layer, an orthographic projection of the barrier layer on the substrate covering the overlapping area, and the barrier layer being used for preventing metals in the first metal trace layer and the second metal trace layer from growing towards each other.

Backplane, backlight source, illumination device and displaying device

A light-emitting substrate includes a base, a first conductive pattern layer disposed on the base and a second conductive pattern layer disposed on a side of the first conductive pattern layer away from the base. The first conductive pattern layer includes first signal lines. The second conductive pattern layer includes lamp bead pads. The lamp bead pads include first lamp bead pads and at least one second lamp bead pad. A vertical projection of each first lamp bead pad on the base at least partially overlaps with a vertical projection of a first signal line on the base. A vertical projection of each second lamp bead pad on the base is outside vertical projections of the first signal lines on the base. A distance between a first lamp bead pad and the base is substantially the same as a distance between a second lamp bead pad and the base.

The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.

Wiring substrate, array substrate and light emitting module having control regions arranged into control region rows and control region columns

An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

A touch panel includes: a substrate; a bridging layer; an insulating layer; and a touch layer, including a first touch area and a border area surrounding the first touch area; the border area includes at least one second touch area, and the second touch area includes a plurality of button portions; a second shielding body is disposed between the second touch area and the first touch area; the border area further includes a bonding area for bonding with a driving circuit board; the second shielding body is provided with at least one wire groove, and at least one touch wire is coupled to the bonding area by passing through the wire groove; and the touch layer is disposed on a surface of the insulating layer away from the substrate, and at least two adjacent shielding units are coupled by the bridging layer.

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Beijing, China

Jie Lei