Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Jie-Cheng Deng

Shi-Wen Zhou

Jun Cao

A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink () contacting one of the electronic components, a pair of fans () attached on a lateral side of the heat sink, and a fan duct () fixed on the fans. A plurality of guiding members () are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver () to accurately fit with screws () preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.

Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board

A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

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Shenzhen, China

Jie-Cheng Deng