Samsung Electronics Co., Ltd.

Jichul Kim

Jae Choon Kim

Eunseok Cho

Jin-Kwon Bae

Chajea Jo

Yunhyeok Im

Kyol Park

Sang-Uk Han

Jinyong Park

Woohyun Park

Kyoung Soon Cho

Heungkyu Kwon

KyongSoon Cho

Hansung Ryu

Eon Soo Jang

Yongjae Song

Gyeongmin Jin

Young-deuk Kim

Yeo-Hoon Yoon

YoungSang Cho

Chihyun Cho

Wook Hwan Kim

Sang Il Kim

Dongku Kang

Jongwoo Park

Youngbae Kim

Jungje Bang

Soojae Park

Kyungsoo Lee

Bongkyu Min

Baekeun Cho

Oleg Feygenson

Mi-Na Choi

Seungkon Mok

Seongho Shin

Kicheol Bae

Yeonkyung Chung

Hyuncheol Jin

MyungKyoon Yim

Taewon Sun

Jaeyeon Ra

Jungsu Ha

Sridhar Sundaram

Eunho Jung

Chagyu Song

According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.

Interposer structure and an electronic device including the same

Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

Printed circuit board assembly and electronic device comprising same

An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second region of the first circuit board, the second second circuit board including a first second portion bonded to the second interposer and spaced apart from the first second circuit board by a specified gap.

Printed circuit module and electronic device including the same

An electronic device is provided. The electronic device includes a rollable display. The electronic device may include a main bracket configured to support the first portion of the rollable display, a roller member disposed in the first direction from the main bracket and arranged in a third direction perpendicular to the first direction, at least one folding support member disposed between the main bracket and the roller member and configured to support the second portion of the rollable display, a circuit board disposed to overlap at least a portion of the main bracket, at least one electronic component disposed adjacent to the roller member, and a FPCB configured to electrically connecting the main circuit board and the electronic component, wherein the FPCB is disposed to pass through the folding support member and extends from a portion of the circuit board to a portion of the electronic component.

Electronic device including rollable display

A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.

Semiconductor package

A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

Semiconductor packages

A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

Thermoelectric cooling packages and thermal management methods thereof

Semiconductor packages having redistribution substrate

A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

Surface temperature management method of mobile device and memory thermal management method of multichip package

Semiconductor packages and methods of fabricating the same are disclosed. The semiconductor package may include a package substrate, a semiconductor chip, which is mounted on the package substrate to have a bottom surface facing the package substrate and a top surface opposite to the bottom surface, a mold layer provided on the package substrate to encapsulate the semiconductor chip, and a heat dissipation layer provided on the top surface of the semiconductor chip. The mold layer may have a top surface substantially coplanar with the top surface of the semiconductor chip, and the top surfaces of the semiconductor chip and the mold layer may have a difference in surface roughness from each other.

Packaged semiconductor chips having heat dissipation layers and ground contacts therein

A power estimation circuit including: a power estimation manager circuit configured to receive power data and temperature data; and a storage circuit that includes a first region storing resistive-capacitive (RC) thermal modeling data, a second region storing the power data and a third region storing the temperature data, wherein the power estimation manager circuit is configured to estimate power consumption of a first node at a second time point, which occurs after a first time point, using the RC thermal modeling data, the power data and the temperature data.

Integrated circuit for estimating power of at least one node using temperature and a system including the same

A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.

Semiconductor package and semiconductor device including the same

A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.

Growing community of inventors

Yongin-si, South Korea

Jichul Kim