Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Tyco Electronics Corporation

Te Connectivity Corporation

Jibin Sun

Peter Trefonas, Iii

Deyan Wang

Terry P Bowen

Jong Keun Park

Young Cheol Bae

Kathleen M O'Connell

Sandeep Razdan

Haipeng Zhang

Seung-Hyun Lee

Cecily Andes

Phillip Dene Hustad

David R Wilson

Cheng-Bai Xu

Mingqi Li

Cong Liu

Emad Aqad

Irvinder Kaur

Thomas P Huegerich

Jieqian Zhang

James J Toth

Christopher D Gilmore

William Atley Weeks

Peng-Wei Chuang

Aleksandar Kolev Angelov

Nicola Pugliano

Matthew M Meyer

Frances T Peralta

An interposer for coupling an optical conduit to an optical component, said interposer comprising: (a) an optical component; (b) a first lens component having a first lens; (c) a second lens component having a second lens, said first and second lenses being configured to define an expanded-beam coupling therebetween; (d) at least one reflective surface optically coupled with said second lens; (e) a first optical path at least partially defined between said optical component and said first lens to accommodate a diverging light beam from said optical component to said first lens; (f) a second optical path at least partially defined between said second lens and said at least one reflective surface to accommodate a converging light beam from said second lens and said at least one reflective surface; and (g) a separable interface along said second optical path or at said expanded-beam coupling.

Interposer with separable interface

Expanded beam (EB) connector includes a fiber holder having an alignment channel that is configured to receive an optical fiber. The alignment channel has a channel opening and extends from the channel opening to a channel end face. The EB connector also includes an optical substrate having a three-dimensional (3D) waveguide that includes a waveguide core and a cladding. The optical substrate includes the channel end face. The waveguide core extends lengthwise between first and second coupling faces of the waveguide core. The first coupling face is at least a portion of the channel end face. The first coupling face is configured to optically couple to the optical fiber disposed within the alignment channel. The second coupling face defines an exterior of the optical substrate. The waveguide core is shaped to change a mode field diameter and a numerical aperture of light propagating between the first and second coupling faces.

Expanded beam connector, optical cable assembly, and method of manufacturing

The invention provides a composition comprising at least the following A and B:

Metal hardmask compositions

A method of forming a pattern by directed self-assembly, comprising: (a) providing a semiconductor substrate comprising one or more layers to be patterned; (b) applying a crosslinkable underlayer composition over the one or more layers to be patterned to form a crosslinkable underlayer, wherein the crosslinkable underlayer composition comprises a crosslinkable polymer comprising a first unit formed from a monomer of the following general formula (I-A) or (I-B): wherein: P is a polymerizable functional group; L is a single bond or an m+1-valent linking group; Xis a monovalent electron donating group; Xis a divalent electron donating group; Arand Arare trivalent and divalent aryl groups, respectively, and carbon atoms of the cyclobutene ring are bonded to adjacent carbon atoms on the same aromatic ring of Aror Ar; m and n are each an integer of 1 or more; and each Ris independently a monovalent group; (c) heating the crosslinkable underlayer to form a crosslinked underlayer; (d) forming a self-assembling layer comprising a block copolymer over the crosslinked underlayer; and (e) annealing the self-assembling layer. The methods and compositions find particular applicability in the manufacture of semiconductor devices or data storage devices for the formation of high resolution patterns.

Directed self-assembly pattern formation methods and compositions

One aspect of the invention provides an optoelectronics structure including: a substrate defining a trench on a first surface; and a VCSEL structure mounted vertically within the trench of the substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate. Another aspect of the invention provides an optoelectronics structure including: an fiber guiding substrate defining a trench on a first surface; a VCSEL structure mounted vertically within the trench of the fiber guiding substrate such that the VCSEL structure emits a laser beam substantially parallel to the substrate; and an optical fiber mounted on the fiber guiding substrate substantially coaxial with the laser beam emitted by the VCSEL structure.

Optoelectronics structures

One aspect of the invention provides a method of fabricating a mode size converter. The method includes: exposing a photoresist-coated substrate to varying doses of light exposure to produce a profile in the photoresist of a beam mode size converter; and etching the photoresist-coated substrate to remove an equal thickness of the photoresist and substrate. The beam mode sized converter includes: a first surface having a first surface height and a first surface width; a second surface opposite the first surface, the second surface having a second surface height different than the first surface height and a second surface width different than the first surface width; and one or more boundary surfaces connecting the first surface and second surfaces.

Mode size converters and methods of fabricating the same

An interposer sub-assembly for holding or gripping a plurality of optical fibers in a multi-fiber ferrule connector including: a substrate comprising a bottom surface, a top surface, and a front face; a pair of guide pin grooves on the bottom surface of said substrate, wherein the pair of guide pin grooves are capable of receiving guide pins from a ferrule connector; and a plurality of resilient fiber grooves formed on the bottom surface, wherein the plurality of resilient fiber grooves are configured for receiving a plurality of optical conduits.

Optical fiber subassembly

Polymers containing a unit having a particular acetal moiety and photoresist compositions containing such a polymer. Substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The polymers, photoresist compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.

Polymers, photoresist compositions and methods of forming photolithographic patterns

Dendritic compounds are provided. The dendritic compounds include an anionic dendron that has a focal point having an anionic group and a linking group, and a photoreactive cation. The dendritic compounds find particular use as photoacid generators. Also provided are photoresist compositions that include such a dendritic compound, as well as methods of forming electronic devices with the photoresist compositions. The dendritic compounds, photoresist compositions and methods find particular applicability in the manufacture of semiconductor devices.

Dendritic compounds, photoresist compositions and methods of making electronic devices

Compositions containing certain organometallic oligomers suitable for use as spin-on, metal hardmasks are provided, where such compositions can be tailored to provide a metal oxide hardmask having a range of etch selectivity. Also provided are methods of depositing metal oxide hardmasks using the present compositions.

Hardmask

Provided are methods of forming photolithographic patterns by negative tone development. The methods employ a photoresist composition that includes a polymer having a unit of the following general formula (I): wherein: Rrepresents hydrogen or a Cto Calkyl group; a represents an integer from 1 to 3; and b represents 0 or 1. The methods find particular applicability in the manufacture of semiconductor devices.

Methods of forming photolithographic patterns by negative tone development

Provided are polymers and photoresist compositions useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.

Growing community of inventors

San Mateo, CA, United States of America

Jibin Sun