University System of Maryland

Sanyo Electric Co., Ltd.

Heat Transfer Technologies, Inc.

Jiazhen Ling

Yunho Hwang

K Reinhard Radermacher

Yiming Wu

Ichiro Takeuchi

Reinhard Radermacher

Jan Muehlbauer

Suxin Qian

Vikrant C Aute

Yoram Leon Shabtay

Osamu Kuwabara

Daniel Fernandes Bacellar

Rohit Dhumane

James M Tancabel

Jelena Srebric

Yilin Du

Daniel Alejandro Dalgo Reyes

Nicholas W Mattise

Reinhard K Radermacher

A heat exchanger has first and second manifold portions and an array of substantially-parallel heat-transfer tubes extending between the first and second manifold portions. Each heat-transfer tube has an outer surface and an inner surface defining a conduit. In a cross-sectional view, the outer surface of each heat-transfer tube can form a first shape that is non-circular, and the inner surface of heat-transfer tube can form a second shape different than the first shape. Alternatively or additionally, at least one of the first shape and the second shape lacks reflectional symmetry in the cross-sectional view. Methods for fabricating such heat exchangers are also provided.

Cross-flow heat exchanger systems and methods for fabrication thereof

A system for heating/cooling includes a plurality of thermoelastic modules. Each of the modules includes one or more structures formed of shape memory alloy, which converts from austenite to martensite upon application of a first stress and release latent heat from the conversion. During a first part of a heating/cooling cycle, a first module is stressed to cause conversion. The latent heat released from the first module is rejected to a heat sink while a second unstressed module absorbs heat from a heat source. During a second part of the heating/cooling cycle, the first and second modules are connected together to transfer heat therebetween for heat recovery. The cycle can be repeated indefinitely with the first and second modules alternating roles. Structures of the thermoelastic cooling material and specific applications thereof are also disclosed.

Solid-state heating or cooling systems, devices, and methods

Despite otherwise uncomfortable conditions in a surrounding environment, a customizable microenvironment can be created around a user to maintain a comfortable temperature and/or humidity level using a comfort unit. For example, the environment may be an office building where conditions are out of the comfortable range to save on energy or for other reasons, a factory/shop environment that is poorly conditioned, or an outdoor location with little to no conditioning. A sensing unit can monitor biometric and environmental data and can determine a comfort level of the user. The comfort unit can then dynamically respond to the determined comfort level and adjust the microenvironment to improve the user's comfort level. The comfort unit can follow the user as the user moves within the macro-environment, or can otherwise move within the macro-environment to achieve certain functions, such as recharging or spatial shifting of thermal load within the overall macro-environment.

Comfort units and systems, methods, and devices for use thereof

An air conditioner having a refrigeration cycle including a compressor, a radiator, a pressure-reducing device and an evaporator, a total heat exchanger for performing heat-exchange between outdoor air and air under cooling operation using the evaporator for a room to be air-conditioned, and for ventilating the room to be air-conditioned, and a desiccant rotor having a moisture adsorbing area for adsorbing moisture in the outdoor air when the outdoor air is introduced, and regenerating the moisture adsorbing area by heat of the radiator, the outdoor air successively flowing through the total heat exchanger, the evaporator and the moisture adsorbing area in this order and then entering the room to be air-conditioned.

Air conditioner having a desiccant rotor with moisture adsorbing area

Growing community of inventors

Ellicott City, MD, United States of America

Jiazhen Ling