Arista Networks, Inc.

Jiayi Wu

Robert Morris Wilcox

Richard Neville Hibbs

Warren Meggitt

Youngbae Park

Andreas Bechtolsheim

Duong Cu Lu

Christophe Metivier

Paul Miller

Xin Xue

David Anthony Cananzi

Alex Rose

An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.

Heat sink for optical transceiver

A network device is provided. The device includes a housing and a switch card, mounted within the housing and having one or more connectors. A plurality of line cards are oriented parallel to each other and orthogonal to the switch card and assembled to the one or more connectors of the switch card. The switch card has a chip, with a plurality of switches or routing paths, and the switch card and the chip couple to the plurality of line cards through the one or more connectors.

Distributed core switching with orthogonal fabric card and line cards

An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

Pluggable optical module with heat sink

An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

Electromagnetic interference absorber ring

An adapter for a communication transceiver is provided. The adapter includes a main body having a first end and opposed second end. The first end of the main body has an OSFP (octal small form factor pluggable) edge connector arranged for electrical and physical connection to an OSFP host connector in an OSFP host port. The main body has a QSFP (quad small form factor pluggable) host connector arranged to receive a QSFP edge connector of a QSFP transceiver through the second end of the main body so that the adapter adapts the QSFP transceiver to an OSFP host. A method of using a communication adapter is also provided.

OSFP to OSFP module form factor adapter

EMI absorber ring

A system may include a reversible fan module that creates an airflow. The reversible fan module may include a set of attachment members, disposed on a face of the reversible fan module, that secure the reversible fan module a first orientation or a second orientation. The system may further include a chassis that include a divider that divides an interior region of the chassis into a front compartment and a rear compartment, a window, disposed on the divider, that allows airflow between the front compartment and the rear compartment, a first opening in the chassis that opens the front compartment to a first external region, a second opening in the chassis that opens the rear compartment to a second external region, and a bay that receives the reversible fan module.

Reversible fan module

QSFP to OSFP module form factor adapter

A reversible fan module may include a first attachment member that may receive power from a controller when an orientation of the reversible fan module is a first orientation; a second attachment member that may receive power from the controller when the orientation of the reversible fan module is a second orientation; a first electrical connection, disposed between the first attachment member and the second attachment member, that may transmit power from the second attachment member to the first attachment member when the orientation of the reversible fan module is the second orientation; and a second electrical connection, disposed between the first attachment member and a fan unit, that may transmit power to the fan unit.

Growing community of inventors

Santa Clara, CA, United States of America

Jiayi Wu