Agere Systems Inc.

Finisar Corporation

Ii-vi Delaware, Inc.

Jiashu Chen

Po Dong

Christof Faller

Frank M Baumgarte

Ricardo Saad

Juthika Basak

Donald Arthur Ice

Lucy G Hosking

Yuxin Zhou

Jingcheng Zhang

Lewis B Aronson

Giorgio Giaretta

Argishti Melikyan

Thomas Gordon Beck Mason

Saied Ansari

Idan Mizrahi

Huy Anh Vu

Christopher Anton Wendt

Steve Macica

A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Modular assembly for opto-electronic systems

A photonic integrated circuit (PIC) device has photonic devices arranged in an array with respect to control and common conductors. Each of the photonic devices has a photonic component (e.g., photodiode, thermo-optic phase shifter, etc.) and a switching diode connected in series with one another between a control connection and a common connection. The photonic component has at least one optical port, which can be coupled to a waveguide in the PIC device. The switching diode is configured to switch between reverse and forward bias in response to the electrical signals. In this way, control circuitry for providing control and monitoring signals to the conductors can be greatly simplified, and the PIC device can be more compact.

Photonic integrated circuit having array of photonic devices

An optical coupling system includes a first waveguide that includes a first waveguide end, a second waveguide end. The optical coupling system includes a first lens that is aligned with a first optical fiber. The optical coupling system includes a first lens holder that retains the first lens. The lens holder includes a waveguide retention portion on which the first waveguide end is positioned such that the first waveguide end is aligned with the first lens. The optical coupling system includes a second lens that is aligned with a first optical component. The optical coupling system includes a second lens holder that retains the second lens. The second lens holder includes a waveguide retention portion on which the second waveguide end is positioned such that the second waveguide end is aligned with the second lens.

Optical coupling systems

An optical coupling assembly includes optical fibers and a fiber coupling structure assembly that includes an active optical component (AOC) array. The AOC array includes wafer material, AOCs, and soldering pads. The fiber coupling structure assembly includes a rigid substrate that defines apertures and includes an array connection surface on which additional soldering pads are formed. The rigid substrate is fixed to the AOC array by bump joints that connect the soldering pads of the AOC array with the additional soldering pads formed on the array connection surface such that each of the apertures is aligned with a corresponding one of the AOCs. The optical fibers may be positioned relative to the one or more apertures such that an optical signal may be communicated between a corresponding one of the optical fibers and a corresponding one of the AOCs via a corresponding one of the one or more apertures.

Optical coupling assemblies

A guide pin wafer may include a base wafer that includes multiple dies. Each die may include a corresponding lens cutout. The guide pin wafer may also include multiple guide pins mounted on the base wafer. Each die of the base wafer may be mounted with two or more corresponding guide pins that may be configured to engage a parallel fiber connector to the corresponding die.

Wafer assembly including a guide pin wafer

A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.

Communications device with integrated case temperature measurement

Generic and specific C-to-E binaural cue coding (BCC) schemes are described, including those in which one or more of the input channels are transmitted as unmodified channels that are not downmixed at the BCC encoder and not upmixed at the BCC decoder. The specific BCC schemes described include 5-to-2, 6-to-5, 7-to-5, 6.1-to-5.1, 7.1-to-5.1, and 6.2-to-5.1, where '0.1' indicates a single low-frequency effects (LFE) channel and '0.2' indicates two LFE channels.

Cue-based audio coding/decoding

The case temperature measurement device for an optoelectronic transceiver includes a case with at least one thermally conductive wall, at least one optical component at least partially disposed within the case, circuitry electrically coupled to the optical component. The circuitry includes a temperature sensor coupled to the circuitry. The case temperature measurement device also includes at least one protrusion formed on the wall of the case of the optoelectronic transceiver. The protrusion is thermally coupled to temperature sensor via a thermal pad. A method for estimating case temperature of the optoelectronic transceiver based on an internal temperature measurement and knowledge of the relationship between the measured internal temperature and the actual case temperature, and compensating for the effects of variable heat sources within the transceiver upon this estimate.

Temperature measurement apparatus for optoelectronic transceiver

Systems and methods for controlling a thermoelectric cooler (TEC) in an optical transceiver. A TEC system includes a processor that interacts with a power supply and a TEC controller to prevent inrush current. The power supply is switched by the processor and turned on only at a particular time. The power supply has a relatively large time constant such that it ramps slowly to its full value. In the meantime, the processor and TEC controller cause the temperature to ramp to a target value by repeatedly incrementing or decrementing a target value over time and by controlling when the maximum available voltage can be applied to the TEC.

Thermoelectric cooler with inrush current control

3D sound is generated using an improved HRTF modeling technique for synthesizing HRTFs with varying degrees of smoothness and generalization. A plurality N of spatial characteristic function sets are regularized or smoothed before combination with corresponding Eigen filter functions, and summed to provide an HRTF (or HRIR) filter having improved smoothness in a continuous auditory space. A trade-off is allowed between accuracy in localization and smoothness by controlling the smoothness level of the regularizing models with a lambda factor. Improved smoothness in the HRTF filter allows the perception by the listener of a smoothly moving sound rendering free of annoying discontinuities creating clicks in the 3D sound.

Generating 3D audio using a regularized HRTF/HRIR filter

This disclosure concerns transceivers that include CDR bypass functionality. In one example, a 10 G XFP transceiver module includes integrated CDR functionality for reducing jitter. The 10 G XFP transceiver module also implements CDR bypass functionality so that the CDR can be bypassed at rate less than about 10 Gb/s, such as the Fibre Channel 8.5 Gb/s rate for example.

Growing community of inventors

Milpitas, CA, United States of America

Jiashu Chen