Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Jiapei Ding

Teng Hock Kuah

Kar Weng Yan

Ravindra Raghavendra

Jian Liao

Shu Chuen Ho

Keng Yew Song

Jian Xiong Su

Zilan Li

Bin Yuan

Rolan Ocuaman Camba

Deivasigamani Mouleeswaran

An apparatus having a seal plate which includes rigid hard portions and one or more flexible soft portions located between the hard portions is used for bonding at least one semiconductor device onto a substrate that is supported on a platform. The seal plate is movable between a first position which is spaced from the substrate and a second position whereat a first side of the seal plate is configured to be in contact with the substrate. A diaphragm covers a second side of the seal plate opposite to the first side. A fluid pressure generator exerts a fluid pressure onto the diaphragm to actuate the diaphragm to compress the one or more soft portions to transmit a bonding force onto the at least one semiconductor device during bonding.

Flexible sinter tool for bonding semiconductor devices

The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion. The spacer also comprises a second portion distal from the pressure application component, wherein in the coupled state, the second portion is proximate the semiconductor device and is operable to transmit the force from the pressure application component to the semiconductor device as a second pressure.

Apparatus and method for processing a semiconductor device

Disclosed is a platen for a molding press for encapsulating semiconductor dies on a substrate, the platen comprising: a first mold chase having a first mold chase surface; the platen being operable to cooperate with a further platen having a second mold chase with a second mold chase surface to clamp a substrate, which is held against a substrate-facing surface relating to either the first or second mold chase surface, between the first and second mold chase surfaces to define at least one mold cavity with respect to the substrate; wherein the platen further comprises a rotational mounting device on which either the first or second mold chase is rotatable about at least one axis passing through the center of the substrate-facing surface to adjust the relative arrangement of the first and second mold chase surfaces. Also disclosed is a molding press comprising the platen, and the further platen cooperating with the platen.

Molding press and a platen for a molding press

An apparatusfor depositing a thin-film onto a surface of a substrateusing precursor gases G, Gis disclosed. The apparatuscomprises i) a supporting devicefor holding the substrate; and ii) a spinnerpositioned adjacent to the supporting device. Specifically, the spinnerincludes a hubfor connecting to a motor, and one or more bladesconnected to the hub. In particular, the one or more bladesare operative to rotate around the hubon a plane to drive a fluid flow of the precursor gases G, G, so as to distribute the precursor gases G, Gacross the surface of the substrate

Apparatus for thin-film deposition

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Singapore, Singapore

Jiapei Ding