Centre National De La Recherche Scientifique

Nanyang Technological University

Université De Lille

Thales Solutions Asia Pte Ltd

Jianxiong Wang

Beng Kang Tay

Philippe Coquet

A nanostructure transfer method is provided. The method includes providing a first substrate () having thereon a plurality of nanostructures (), the nanostructures () extending away from the first substrate (). A solder material () is deposited on distal ends of the nanostructures (). A second substrate () having thereon a first metal layer () is provided. The solder material () is bonded to the first metal layer (), thereby attaching the nanostructures () to the second substrate (). The attached nanostructures () are then released from the first substrate ().

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Singapore, Singapore

Jianxiong Wang