Average Co-Inventor Count = 2.87
ph-index = 5
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Freescale Semiconductor,inc. (8 from 5,491 patents)
2. Qualcomm Incorporated (6 from 41,326 patents)
14 patents:
1. 12218041 - Integrated circuit (IC) packages employing a capacitor-embedded, redistribution layer (RDL) substrate for interfacing an IC chip(s) to a package substrate, and related methods
2. 11784157 - Package comprising integrated devices coupled through a metallization layer
3. 10141202 - Semiconductor device comprising mold for top side and sidewall protection
4. 9318405 - Wafer level package without sidewall cracking
5. 9054111 - Electronic device and method of packaging an electronic device
6. 9034697 - Apparatus and methods for quad flat no lead packaging
7. 8841168 - Soldering relief method and semiconductor device employing same
8. 8617935 - Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages
9. 8609471 - Packaging an integrated circuit die using compression molding
10. 8461676 - Soldering relief method and semiconductor device employing same
11. 8327532 - Method for releasing a microelectronic assembly from a carrier substrate
12. 8236609 - Packaging an integrated circuit die with backside metallization
13. 8216918 - Method of forming a packaged semiconductor device
14. 7595226 - Method of packaging an integrated circuit die