Applied Materials, Inc.

Quantum Global Technologies LLC

Jianqi Wang

Kevin A Papke

William Ming-ye Lu

Rajan Balesan

Samantha S H Tan

Robert P Chebi

Yao-Hung Yang

Mats Larsson

Yixing Lin

Joseph Frederick Sommers

Michael J Coughlin

Yogita Pareek

Chih-Yang Chang

Robert C McIntosh

Alfredo Granados

Yukari Nishimura

Sio On Lo

Shannon Wang

Joung Woo Lee

Gia Pham

Zhao H Ceng

Alex Gerrard

William Ming-Ye Lu

Methods for texturing a surface of a component which include partially submerging the component within a liquid such that a first portion of the component is not submerged in the liquid and a second portion of the component is submerged in the liquid; and contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component to a first surface roughness, wherein the second portion of the component is either not textured by the laser beam, or is textured to a lesser degree than the first portion of the component and has a second surface roughness which is less than the first surface roughness.

Method and apparatus for laser texturing a component

In some embodiments, a sonic cleaning system includes a tank configured to receive a liquid that enables propagation of sonic waves and a cylindrical insert located within the tank. The cylindrical insert includes a first end having a first opening and a second end opposite the first end. The second end has a second opening. The cylindrical insert is configured to suspend a workpiece between the first opening and the second opening. The sonic cleaning system includes a sonic transducer located within the cylindrical insert.

Sonic cleaning system and method of sonic cleaning a workpiece

Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.

Coolant and a method to control the pH and resistivity of coolant used in a heat exchanger

Embodiments of the disclosure provide a chamber component for use in a plasma processing chamber apparatus. The chamber component may include a coating layer that provides a fluorine-rich surface. In one embodiment, a chamber component, for use in a plasma processing apparatus, includes a body having an outer layer comprising yttria having a coating layer formed thereon, wherein the coating layer comprises a yttrium fluoride containing material.

Chemical conversion of yttria into yttrium fluoride and yttrium oxyfluoride to develop pre-seasoned corossion resistive coating for plasma components

The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.

30 nm in-line LPC testing and cleaning of semiconductor processing equipment

Embodiments described herein generally relate to an apparatus and methods for reducing the deposition of polymers in a semiconductor processing chamber. A heater jacket and heat sources are provided and may be configured to maintain a uniform temperature profile of the processing chamber. A method of maintaining a uniform temperature profile of a dielectric ceiling of the processing chamber is also provided.

Enhanced productivity for an etch system through polymer management

A processing chamber component and method for fabricating the same are provided. The processing chamber component is fabricated in the manner described herein and includes the creation of at least a macro texture on a surface of the chamber component. The macro texture is defined by a plurality of engineered features arranged in a predefined orientation on the surface of the chamber component. In some embodiments, the engineered features prevent formation of a line of sight surface defined between the features to enhance retention of films deposited on the chamber component.

Geometries and patterns for surface texturing to increase deposition retention

A method is provided for recovering a metal from electronic device deposition equipment including: providing deposition equipment wherein the deposition equipment is at least partially coated with a deposited metal; blasting the deposition equipment with a grit to remove at least some of the deposited metal to form a blasted grit and a removed metal; and separating at least some of the removed metal from the blasted grit to form a recovered metal.

Methods for cleaning process kits and chambers, and for ruthenium recovery

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Fremont, CA, United States of America

Jianqi Wang