Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Jianping Chen

Gunther Dreezen

Allison Yue Xiao

Qili Wu

Rudolf Oldenzijl

Jie Cao

Bo Xia

Rudie Oldenzijl

Jose Garcia-Miralles

This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m/g.

Flexible conductive ink

Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.

Submicron silver particle ink compositions, process and applications

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Irvine, CA, United States of America

Jianping Chen