Google Inc.

Altera Corporation

Jianmin Zhang

Yao Ding

Guohua Sun

Gemin Li

Shengyin Ding

Hong Shi

Xiaohong Jiang

Myung June Lee

Jianming Huang

The present disclosure provides for an arrangement of components within a hearable device, such as earbuds, to reduce H field coupling for E noise improvement. A battery is positioned above a magnet and speaker, such that the battery is not coaxially aligned with either the magnet or the speaker. An internal positive tab of a battery is positioned farthest from a speaker yoke, while an internal negative tab of the battery is closer to the speaker yoke. Magnetic flux poles of a contact magnet have different contributions for electric field coupling.

Method to reduce H-field coupling for E-noise and a kind of non-coaxial integrated earbuds

Integrated circuit packages with openings surrounding a conductive via on a substrate layer are disclosed. An integrated circuit package may include a substrate layer with upper and lower surfaces. A conductive via may extend between the upper and lower surfaces of the substrate layer. The integrated circuit package further includes multiple openings in the substrate layer that may be distributed evenly in the substrate layer surrounding the conductive via. The multiple openings reduce signal insertion loss of the conductive via.

Integrated circuit package substrate with openings surrounding a conductive via

An integrated circuit package substrate may include a core layer and dielectric layers formed on top and bottom surfaces of the core layer. Routing traces such as stripline structures may be formed in some of the dielectric layers, whereas plated through hole (PTH) structures may be formed through the core layer. A first pair of PTHs that carry a first differential signal may be orthogonally intertwined with a second pair of PTHs that carry a second differential signal. Solder balls formed at the surface of the package substrate may include a first pair of solder balls that convey a first differential signal that is orthogonally intertwined with respect to a second pair of solder balls that convey a second differential signal. The package substrate may be mounted on a printed circuit board (PCB). Differential PCB vias could use the same BGA orthogonal pattern described above.

Integrated circuit package routing with reduced crosstalk

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Los Gatos, CA, United States of America

Jianmin Zhang