Intel Corporation

China Resources Powtech (shanghai) Co., Ltd.

Hangzhou Nuoyi Medtech Co., Ltd

Jianmin Li

Lei Zhang

Wei Guo

Yong You

Jin Li

Xiang Yin Zeng

Yongsheng Wang

Henry Xu

Guocheng Li

John J Tang

Bingyin Luo

Yujie Wang

Linhai Xu

Jiaming Qiu

Huiyuang Ren

A venous valve replacement device includes a stent with a blood flow channel and two leaflets connected to the stent, wherein one side of each leaflet is configured as a fixed edge connected with the stent, and the other side is configured as a movable edge, and wherein the movable edges of the two leaflets cooperates with each other to open or close the blood flow channel, and the movable edges of the two leaflets are provided with flaps that attach to each other in a closed configuration.

Venous valve replacement device

A system and method for detecting voltage of a battery pack. The system comprises a level transfer circuit array, a multipath data selector, a decoder, a trimming calibration circuit, and an output buffer. The decoder is configured to parse a battery pack cell gating signal; the level transfer circuit array is configured to convert a gated battery pack cell voltage into a common grounded voltage; the multipath data selector is configured to transmit the common grounded voltage, which is converted by the level transfer circuit array, of a battery pack cell to the trimming calibration circuit; the trimming calibration circuit is configured to correct the received common grounded voltage of the battery pack cell; and the output buffer is configured to buffer the common grounded voltage, which is trimmed and calibrated by the trimming calibration circuit, of the battery pack cell.

System and method for detecting voltage of battery pack

An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.

Copper plating connection for multi-die stack in substrate package

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Shanghai, China

Jianmin Li