Lucent Technologies Inc.

Jianluo Zhang

Yuan P Li

Chellappan Narayanan

Scott Thomas Davies

Daren Li

Kevin G Sullivan

An optical interconnection device has a passive control mechanism for substantially eliminating thermal effects on optical properties of the apparatus Specifically, the interconnection apparatus includes a control material coupled to an optical circuit substrate, wherein the control material has a thermal expansion coefficient that is different than a substrate thermal expansion coefficient. In response to an increase or decrease an ambient temperature, the control material thermally expands or contracts at a different rate than the substrate to create a non-planar substrate distortion transmitted to the core portion, thereby creating a temperature independent optical path length within the optical core portion.

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Suwanee, GA, United States of America

Jianluo Zhang