Shanghai Micro Electronics Equipment (Group) Co., Ltd.

Jianjun Zhao

Zhi Yong Zhu

Zhijun Huo

An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group () disposed on one side of the press assembly. The press assembly includes a first chuck () and a rotatable second chuck (). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate () is then loaded on the first chuck, and alignment marks () on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate () is loaded on the second chuck, and alignment marks () on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned. In this method, the chucks are adjusted, prior to the alignment of the substrates. This dispenses with the need for employment of high-precision components and reduces the complexity of the apparatus. Moreover, adjusting the chucks first can ensure control of a global alignment accuracy between the substrates, and in particular, can reduce wedge-shaped errors between the substrates that may result from deformations of the substrates during bonding.

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Shanghai, China

Jianjun Zhao