Bitmain Technologies Limited

Jianjun Pan

Xudong Wang

Lei Zhang

Shuhao Zhang

Xuesong Zhou

Shizhen Liao

Disclosed are a PCB heat dissipation assembly () and a server having same. The PCB heat dissipation assembly () includes: a PCB board (), a plurality of chips () being arranged on the PCB board (); at least one heat sink (), the heat sink () being arranged on the plurality of chips (), and the heat sink () including a heat dissipation air duct (); and an air baffle (), the air baffle () being arranged adjacent to the at least one heat sink (), the air baffle () being located on one side of the at least one heat sink (), and the air baffle () extending along the heat dissipation air duct ().

PCB heat dissipation assembly and server having same

The present application discloses a case assembly for a server and a server having same. The case assembly () is divided into a first case body () and a second case body () in a first direction, both a side of the first case body () that faces the second case body () and a side of the second case body () that faces the first case body () are open, and the first case body () and the second case body () are detachably connected and jointly define an accommodation space.

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Beijing, China

Jianjun Pan