Arcsoft Corporation Limited

Hangzhou First Applied Material Co., Ltd.

Zhejiang First Advanced Material R&d Institute Co., Ltd.

Hangzhou First Electronic Material Co., Ltd

Jianhua Lin

Guangda Zhou

Li Yu

Feng Zhou

Hongbing Hou

Xi Xiong

Long Wang

Mengjuan Wei

Guodong Tang

Yan Sang

Rongbai Tong

Weijie Li

Gaohua Zhu

Weiqiang Qian

The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.

Photosensitive resin composition and use thereof

The present disclosure discloses a low-water-vapor-permeability polyolefin-elastomer film and its preparation method. The film comprises: 50-100 mass parts of a matrix resin, 0-40 mass parts of a modified resin, 0.001-2 mass parts of an activator, 0.1-3 mass parts of an organic peroxide, 0.02-5 mass parts of an assistant cross-linker, 0.02-2 mass parts of a silane coupling agent, 0.005-2 mass parts of a light stabilizer, and 0-20 mass parts of a water blocking filler. In the present disclosure, by adding the modified resin and the activator that have an active group, a cross-linking degree and a cross-linking density of the film are improved, and a water-vapor permeability is reduced; by adding the water blocking filler, the water blocking property of the film is further improved, thereby ensuring reliability of the assembly, and prolonging service life of the assembly.

Low-water-vapor-permeability polyolefin-elastomer film and method for preparing the same

The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.

High light transmittance photovoltaic encapsulating material

An apparatus for image processing includes a processor and a depth camera. The processor obtains a first two-dimensional image and focusing information of the first two-dimensional image, and obtains depth information of a part or all of a content captured in the first two-dimensional image via the depth camera. The processor determines a background area of the first two-dimensional image according to the focusing information. The processor also performs bokeh on the background area of the first two-dimensional image according to the depth information.

Method and apparatus for image processing

The present invention provides a method and an apparatus for image processing, applied in image processing field, where the method comprises: obtaining a first two-dimensional image and focusing information of the first two-dimensional image, obtaining depth information of a part or all of a content in the first two-dimensional image, determining a background area of the first two-dimensional image according to the focusing information, performing bokeh on the background area of the first two-dimensional image according to the depth information. The above method can reduce requirements for hardware, operate easily, and perform bokeh on the background quickly when performing bokeh on the background.

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Hangzhou, China

Jianhua Lin