Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Asm Assembly Automation Limited

Jiangwen Deng

Wui Fung Sze

Wing Hong Leung

Zhuanyun Zhang

Hei Lam Chang

Lei Song

Chung Sheung Yung

Lap Kei Chow

Po Lam Au

Lian Hok Tan

Fan Leuk Lai

Chung Yan Lau

Ran Shi Wang

Chi Shing Wong

Qi Lang

Fang Han Chen

Malliah Ramkumar

Hong Liang Lu

An alignment apparatus for aligning a lens module with respect to an image sensor includes a holographic film including a test chart pattern from which a virtual image of the test chart pattern may be generated, and a light source for illuminating the holographic film. An image sensor holder is provided for mounting the image sensor and a lens module holder is configured and positioned for mounting the lens module between the holographic film and the image sensor such that the virtual image of the test chart pattern is viewable by the image sensor through the lens module. The virtual image thus viewable by the image sensor through the lens module is located at a virtual distance from the image sensor that is different from a physical position of the holographic film for aligning the lens module with respect to the image sensor.

Apparatus and method for imaging lens alignment using a virtual test image

An imaging device testing system has a light receiver for receiving light from an imaging device under test, a light emitter for returning the light back to the imaging device under test, and first and second transceiver tables movable relative to each other. The first transceiver table has a first light redirecting module for receiving the light from the light receiver and the second transceiver table comprising a second light redirecting module for transmitting the light to the light emitter. The first and second light redirecting modules are positionable to simulate a distance travelled by the light from the light receiver, through the first and second light redirecting modules and a gap between the first and second light redirecting modules, to the light emitter.

Apparatus and method for calibrating or testing an imaging device

An apparatus for inspecting a semiconductor die bonded on a top surface of a substrate uses an optical assembly including an image sensor and an optical system for conducting the inspection. The optical assembly is tilted at an oblique angle with respect to the top surface of the substrate, and is arranged such that its depth of focus is substantially perpendicular to the top surface of the substrate for inspecting at least one side wall of the semiconductor die.

Apparatus and method inspecting bonded semiconductor dice

After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its focal plane configured at a first distance from the second optical system. After the bond head is moved adjacent to the second optical system, the second optical system views and determines a position and orientation of the bond head when the second optical system has its focal plane configured at a second distance from the second optical system. The position and orientation of the die may then be adjusted to correct a relative offset between the die and the bonding location prior to depositing the die onto the bonding location.

High-precision bond head positioning method and apparatus

A confocal imaging apparatus for inspecting an object comprises a light source operative to project light to illuminate the object, and an imaging device for receiving light reflected from the object along a lighting path located between the object and the imaging device. A pinhole array comprising a plurality of pinholes is positioned along the lighting path such that light reflected from the object is passed through the pinhole array. A mechanism is operative to move the pinhole array along a single axis in a linear direction transverse to the light path for transmitting an image corresponding to a substantially contiguous area of the object onto the imaging device.

Confocal imaging of an object utilising a pinhole array

Disclosed is an apparatus for reconstructing a three-dimensional profile of a target surface of an object. The apparatus comprises: i) a lighting apparatus having at least two modes of illumination to illuminate the target surface, wherein a first mode of illumination produces a pattern onto the target surface and a second mode of illumination illuminates every part of the target surface; ii) an imaging device for capturing respective images of the target surface upon a sequential activation of the first and second modes of illumination of the target surface by the lighting apparatus; and iii) a processor for reconstructing the three-dimensional profile of the target surface based on the images of the target surface as captured by the imaging device. A method of reconstructing a 3D profile of a target surface of an object is also disclosed.

Apparatus and method for reconstructing a three-dimensional profile of a target surface

A method of scanning a surface of an object using a confocal imaging system comprises the steps of obtaining first, second and third confocal images of the surface of the object when the object is illuminated respectively by light rays having first, second and third spectral waveforms, and using a camera to capture responsive signals from the object illuminated by the first, second and third spectral waveforms. The first, second and third spectral waveforms are distinguishable from one another and each spectral waveform has overlapping portions relative to another spectral waveform. Thereafter, heights of a plurality of points on the surface of the object corresponding to the plurality of points on each confocal image are determined based on said captured responsive signals.

Vertical chromatic confocal scanning method and system

For aligning an image sensor relative to a lens module prior to fixing the image sensor to the lens module, an exposure of the image sensor is turned on and the image sensor is moved to different distances relative to the lens module. At certain predetermined distances between the image sensor and the lens module, a calibration pattern is illuminated and two or more pictures of the calibration pattern which is focused through the lens module are captured with the image sensor to produce at least two pictures of the calibration pattern captured at different distances, the at least two pictures being superimposed onto a calibration image. The exposure of the image sensor is then turned off and the pictures of the calibration pattern are analyzed for determining an alignment between the lens module and the image sensor.

Active lens alignment system

An apparatus for inspecting a surface of an object has a first light source operative to illuminate the object without producing a patterned image onto the object. A second light source projects a patterned image produced from a first polarized light from the second light source onto the object, wherein the first polarized light is polarized in a first polarization direction. A third light source projects the patterned image produced from a second polarized light from the third light source onto the object, wherein the second polarized light is polarized in a second polarization direction different from the first polarization direction. An imaging device views the surface of the object when the object is illuminated separately by the first, second and third light sources respectively for determining a profile of the surface of the object.

Three-dimensional imaging using a multi-phase projector

A method for inspecting a substrate having intrinsic heterogeneous patterns for the presence of cracks comprises the steps of providing an optical device and front-side lighting on a first side of the substrate and providing near-infrared lighting on a second side of the substrate opposite to the first side. The near-infrared lighting is operable to penetrate the substrate so as to be detectable by the optical device through the substrate. One or more images are obtained by illuminating the substrate with the front-side lighting and/or the near-infrared lighting from the second side. The one or more images are thereafter processed to distinguish between the heterogeneous patterns on the substrate and any cracks present on the substrate.

Method for inspecting a photovoltaic substrate

A chromatic confocal scanning apparatus comprises a light source for producing light rays comprising a plurality of wavelengths, a first screen having an open elongated slit which allows a strip of light rays produced from the light source to pass through the slit and a cylindrical objective lens both to converge the light rays onto an object surface that is to be measured, and to image light rays reflected from the object surface. An intermediate cylindrical lens set converges a strip of light rays imaged from the cylindrical objective lens to pass through an open elongated slit comprised in a second screen, and a color sensor receives light rays which have passed through the slit of the second screen for determining a plurality of wavelengths of the said strip of light rays, to thereby construct a height profile of at least a portion of the object surface.

Chromatic confocal scanning apparatus

An apparatus for measuring a height of an object plane or multiple points on an object is disclosed. The apparatus comprises an imaging system having a focal plane passing through a focal point of the imaging system, wherein the focal plane of the imaging system is tilted at an oblique angle with respect to the object plane such that only a small portion of the object is in focus. Alternatively, the focal plane is tilted at an oblique angle with respect to a scanning direction of the imaging system during relative movement between the imaging system and the object.

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Hong Kong, China

Jiangwen Deng