Gould Electronics Inc.

Nikko Materials Usa, Inc.

Ga-tek, Inc.

Jiangtao Wang

Sidney J Clouser

Dan Lillie

Michael A Centanni

John P Callahan

John Callahan

David B Russell

Atnaf Admasu

John C Briggs

Michael L Stevens

A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.

Etching solution for forming an embedded resistor

The invention relates to a process to enhance adhesion of resistive foil to laminating materials, including: providing a copper foil; depositing at least one resistive metal layer on at least one side of the copper foil; and applying at least one layer of at least one adhesion-promoting material over and adhered to the resistive metal layer, the adhesion-promoting material being suitable for enhancing adhesion between the resistive metal layer and laminating materials. The resistive metal layer may include NiCr, NiCrAlSi, aluminum, nickel, zinc, titanium, vanadium, chromium, manganese, iron, tantalum, molybdenum, ruthenium, and alloys, oxides, nitrides and silicides thereof. The invention further relates to a multilayer foil and to a laminate, both including the resistive metal layer and adhesion-promoting material.

Process for improving adhesion of resistive foil to laminating materials

A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.

Process for manufacturing copper foil on a metal carrier substrate

A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 &angst; and 70 &angst; is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 &angst; and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 &angst; and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

Resistor component with multiple layers of resistive material

A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 &angst; and 70 &angst; is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 &angst; and 500 &angst; is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 &angst; and 500 &angst; is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 &angst; and about 70 &angst;. A vapor deposited resistive material is provided on the stabilization layer.

Applying resistive layer onto copper

Method of forming chromium coated copper for printed circuit boards

A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.

Thin copper on usable carrier and method of forming same

An electrodeposition cell for electrodepositing metal onto a surface of a rotating drum that is partially immersed in an electrolytic solution. The cell includes an anode comprised of a main anode body portion and an anode extension portion. The main anode body portion has an arcuate main anode body surface having a radius of curvature slightly larger than the radius of curvature of the drum. The main anode body portion is totally immersed in the electrolytic solution adjacent the drum wherein a generally uniform gap is formed therebetween. The anode extension portion has an anode extension surface facing the drum and at least one opening extending therethrough. The anode extension portion is disposed within the electrolytic solution wherein a portion thereof extends above the electrolytic solution and the electrolytic solution can flow through the opening. A power source is connected to the main anode body portion and the anode extension portion to produce a like potential on the anode body surface and the anode extension surface, wherein the main anode body portion produces a first current density on the drum in a zone where the drum and the main anode body portion are adjacent and the anode extension portion produces a second current density on the drum in a zone where the drum and the anode extension portion are adjacent. The second current density is equal to or less than the first current density.

Growing community of inventors

Cleveland Heights, OH, United States of America

Jiangtao Wang