Shannon Systems Ltd.

Jiangshan Li

Jia He

Xinglong Wang

A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module, and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid, a cooling channel, and at least one heat conductive rib. The cooling channel extends into the heat dissipation unit. The working fluid travels in the cooling channel. The heat conductive rib extends into the cooling channel. The solid-state storage device satisfies the specification of SNIA SFF-TA-1008.

Server apparatus and solid-state storage device thereof

A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid and a cooling channel. The cooling channel extends in the heat dissipation unit. The working fluid travels through the cooling channel. The heat dissipation unit comprises a plurality of restriction stages. The restriction stages abut the solid-state storage module and restrict the solid-state storage module. The solid-state storage device satisfies the SNIA SFF-TA-1008 specification.

An electronic device with storage functionality is provided. The electronic device includes a first housing member, a first circuit board, a second housing member and a second circuit board. The first circuit board is connected to the first housing member. The second circuit board is coupled to the first circuit board and is parallel to the first circuit board. The first housing member includes two hooks, and the hooks are wedged against the first edge of the second circuit board.

Electronic device with storage functionality

A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.

Memory device

An add-in module is provided. The add-in module includes a substrate, a plurality of first heat sources, a plurality of second heat sources, a heat sink and a heat-dissipation plate. The substrate includes a first substrate surface and a second substrate surface. The first substrate surface is opposite the second substrate surface. The first heat sources are disposed on the first substrate surface. The second heat sources are disposed on the second substrate surface. The heat sink corresponds to the first substrate surface and is thermally connected to the first heat sources, wherein the heat sink includes a heat-sink base and a plurality of heat-dissipation fins, and the heat-dissipation fins are connected to the heat-sink sink base. The heat-dissipation plate corresponds to the second substrate surface and is thermally connected to the second heat sources.

Add-in module

An electronic device with a storage function is provided. The electronic device includes a main connection bolt and a housing. The housing includes a first housing member and a second housing member. The first housing member includes two hooks and a fastening portion. The second housing member includes two wedging portions and a fastening base. The hooks are wedged into the wedging portions to restrict the freedom of the first housing member to move relative to the second housing member in a first direction. The main connection bolt connects the fastening portion to the fastening base in a second direction to restrict the freedom of the first housing member to move relative to the second housing member in the first direction. The first direction is perpendicular to the second direction.

Electronic device with storage function

A solid state memory device is provided. The solid state memory device includes a housing and a solid state memory module. The housing includes a housing fastening member, a first housing member, and a second housing member, wherein the second housing member is connected to the first housing member. The solid state memory module is disposed in the housing. The first housing member includes a plurality of first wedging portions, and the second housing member includes a plurality of second wedging portions. Each first wedging portion wedges the corresponding second wedging portion in a first direction. The first housing member further includes a first fastening portion, and the second housing member further includes a second fastening portion. The housing fastening member affixes the first fastening portion to the second fastening portion in a second direction, wherein the first direction differs from the second direction.

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Shanghai, China

Jiangshan Li