Intel Corporation

Jianggi He

Yuan-Liang Li

Dong Zhong

Hyunjun Kim

Jung S Kang

Thomas Dory

Dong-Ho Han

Sriram Muthukumar

Joong-Ho Kim

Joel A Auernheimer

Chee Hoo Lee

Udy A Shrivastava

Prashant D Parmar

In an integrated circuit design, flex tape is used to provide signal ingress/egress to/from the integrated circuit design. Various architectures for the signal ingress/egress via flex tape is provided. In one embodiment, coaxial design is provided. In another embodiment, a coplanar waveguide design is provided.

Flex tape architecture for integrated circuit signal ingress/egress

Some embodiments of the present invention include providing high performance integrated inductors.

High performance integrated inductor

According to embodiments of the present invention, a balun is disposed on a package that is to receive a die. In embodiments, the balun includes a first metal trace disposed on a first base and a second metal trace disposed on a second base. In embodiments, the first metal trace is one-quarter wavelength of an operating wavelength for a radio frequency (RF) signal and the second metal trace is three-quarters wavelength of the wavelength.

Package integrated one-quarter wavelength and three-quarter wavelength balun

This invention relates to an apparatus and methods for reducing the impedance mismatch problem encountered by differential signaling in conductive core substrates, while maintaining adherence to the common mode noise assumption. Specifically, the conductive paths that traverse through the conductive core are separated by a nonconductive material which minimize impedance and interruption of the signal coupling.

Substrate method and apparatus

A socket electrically connects an integrated circuit package and a circuit board. The socket includes a frames having a plurality of electrical connectors mounted to the frame. The plurality of electrical connectors includes at least one pair of power and ground connectors, with power connector including a first broadside portion and the ground connector including a second broadside portion. The first and second broadside portion are disposed in an adjacent, spaced-apart, and substantially parallel relationship.

Power and ground connectors for socket

A apparatus is disclosed for use as part of the packaging of an integrated circuit. The apparatus includes one or more flex tapes coupled to the integrated circuit. These flex tapes are utilized to deliver power to the integrated circuit.

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Chandler, AZ, United States of America

Jianggi He