Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Other

Henkel US IP Lcc

Jiangbo Ouyang

Wenhua Zhang

John Gregory Woods

Bahram Issari

Shengqian Kong

Smita M Shah

Lynnette M Hurlburt

Yayun Liu

Stephen Hynes

Chunyu Sun

Anthony Francis Jacobine

Robert P Cross

Laxmisha Sridhar

Charles Willard Paul

Cheng Lu

Andrew D Messana

Paul B Foreman

Puwei Liu

Yuxia Liu

Joel D Schall

David P Birkett

Darel L Gustafson

David Mullen

Chao Hu

Martin Wyer

Rudolf Oldenzijl

Zhuming Shi

Inge Van Der Meulen

Yu Chen

Li Kang

Xiaoyan Huang

Zhan Yang

Junwei Yang

Xiao Allison Yue

ChunHua Gu

Austin Sloan

Swapnali Chaudhari

Xiao Alison Yue

Dual-cure compositions for use in high temperature adhesive applications, and particularly for temporarily adhesively attaching one substrate to another substrate, are provided. These dual-cure adhesives are silicone-based compositions that can be B-staged by exposure UV radiation to provide initial green strength, followed by a C-stage cure to give adhesives that can survive high temperature processes above 200° C., especially above 300° C., yet easy to debond afterwards to allow separation of the top and bottom substrates.

Debondable compositions

Provided herein are stretchable conductive inks consisting of a continuous polymer phase with dispersed silver flakes and a low melting metal or alloy, wherein initial resistivity is measured before elongation and the resistivity of the stretchable conductive ink composition is less than 10 times the initial resistivity at 50% elongation.

Stretchable electrically conductive ink compositions

Disclosed herein are stretchable conductive ink compositions comprising a polymer, conductive flake, an additive, and optionally conductive beads, wherein the initial resistivity is measured before elongation, and wherein the resistivity at 50% elongation is about 10 times or less of the initial resistivity.

Provided herein are high refractive index compositions with excellent light stability, and methods for the use thereof, as well as assemblies and articles prepared using invention formulations and methods.

Light stable transparent adhesive compositions and methods for use thereof

This invention relates to a (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer, preparation method and use thereof. The (meth)acrylate-functionalized poly(meth)acrylate-block-polyimide-block-poly(meth)acrylate copolymer according to the present invention exhibits outstanding thermal stability and excellent optical properties.

(Meth)acrylate functionalized poly(meth)acrylate-block-polyimide- block-poly(meth)acrylate copolymer, preparation method and use thereof

The present invention relates to a photo-curable adhesive composition comprising a (meth)acrylate capped aliphatic polyurethane having an average number of ethylenically unsaturated groups less than 1, a mono-functional (meth)acrylate monomer or oligomer and a photoinitiator. The adhesive composition can be used in a method of bonding a substrate to a liquid crystal display. The adhesive composition according to the present invention has improved side curing depth.

Photo-curable adhesive composition, its preparation and use thereof

Disclosed is a highly fluorinated silicone resin and a method for making the same. The silicone resin includes M, T, optionally D and optionally Q type monomers and is crosslinkable. The resin has a fluorine content of at least 55 weight percent and a very low refractive index of less than 1.4. The resin is formed in a one step process and requires use of very specific solvents. Preferably the resin includes a first T type monomer having a fluoroalkane group to provide the fluorine to the resin. Preferably the resin includes a second T type monomer having a (meth)acryloyl function to enable cross-linking. The resin forms an effective liquid optically clear adhesive. The resin can be further combined with highly fluorinated (meth)acrylate monomers or perfluoro polyethers to provide even lower refractive indexes and improved adhesive properties.

Reactive resins and formulations for low refractive index and low dielectric constant applications

The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.

1K UV and thermal cure high temperature debondable adhesive

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si&#x2014;H hydrogens on a silane or siloxane having terminal Si&#x2014;H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

High temperature debondable adhesive

The present invention discloses polymers prepared from polar vinyl monomers and non-polar olefin monomers with the polymers having high olefin content and high weight average molecular weights as well as methods of preparing them. The inventive polymers possess interesting properties that make them particularly attractive in several industrial applications.

High molecular weight polymers having high olefin content

Benzoylthiourea or benzoylthiourethane derivatives as cure accelerators in primers for two step adhesive systems are provided.

Accelerators for two step adhesive systems

Silicone acrylic hybrid compositions prepared by reacting together silicone polymers, silicone resins, and silyl containing acrylic polymers are useful in adhesive compositions that find use in skin contact applications.

Silicone acrylic hybrid polymer-based adhesives

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Wallingford, CT, United States of America

Jiangbo Ouyang