Asm Technology Singapore Pte Ltd

Jiang Wen Deng

Gary Peter Widdowson

Wing Hong Leung

Pak Kin Leung

Wing Chiu Lai

Man Lai Chau

Yi Kei Law

Kin Fung Yu

Chuek Wah Tang

Chi Shing Wong

Yuet Wu

Hei Lam Chang

Tim Wai Mak

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Atomization mechanism for cooling a bond head

There is provided an apparatus for alignment of a thin-film transistor (TFT) panel and a barrier panel of a three-dimensional (3D) display. The apparatus comprises at least one light source for illuminating pixels in at least one region of the TFT panel and for illuminating at least one region of an exposure pattern of the barrier panel; a pattern recognition system for detecting light emitted from the at least one light source that is reflected by or transmitted through the 3D display, to generate alignment data relating to an alignment between the detected illuminated pixels of the TFT panel and the exposure pattern of the barrier panel; and a positioning mechanism for adjusting the relative position between the barrier panel and the TFT panel in relation to the alignment data. The at least one light source comprises at least one invisible light source which emits invisible light outside the visible region of the electromagnetic spectrum.

3D display alignment method

A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.

Image-assisted system for adjusting a bonding tool

Growing community of inventors

Hong Kong, China

Jiang Wen Deng