Vivalnk, Inc.

Advanced Micro Devices Corporation

Thin Film Electronics Asa

Kovio, Inc.

Spansion Llc.

Jiang Li

Junfeng Mei

Arvind Kamath

Nian Niles Yang

Erik C Scher

Zhigang Wang

Patrick Smith

Criswell Choi

John JianShi Wang

Yider Wu

Richard M Fastow

Lee Edward Cleveland

Jean Y Yang

Zhizheng Liu

Kevin Iliff McCarthy

Ming Sang Kwan

Michael K Kocsis

Gloria Wong

Fan Wan Lai

Steve Tam

An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

Electronic stickers with modular structures

High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

High precision capacitors

A multi-purpose wearable patch includes a stretchable and permeable substrate, a first sensing unit mounted in the stretchable and permeable substrate, the sensing unit that can conduct a first measurement of a user to produce a first measurement signal, a treatment unit that produces a first treatment field in the user's body; a circuit electrically connected with the treatment unit and the sensing unit; and a semiconductor chip in connection with the circuit and configured to receive the first measurement signal from the sensing unit. The semiconductor chip produces a first treatment control signal to control the treatment unit to produce a first treatment field in the user's body.

Multi-purpose wearable patch for measurement and treatment

A dual purpose wearable patch includes a stretchable and permeable substrate, a sensing unit mounted in the stretchable and permeable substrate, wherein the sensing unit can conduct a measurement of a user to produce a measurement signal, one or more electrodes respectively attached to the stretchable and permeable substrate, a circuit substrate on the stretchable and permeable substrate, wherein the circuit substrate includes a circuit electrically connected with the one or more electrodes and the sensing unit, and a semiconductor chip mounted on the circuit substrate and in connection with the circuit. The semiconductor chip can receive the measurement signal from the sensing unit and can produce a treatment control signal to control the one or more electrodes to apply a voltage across the user's body.

Dual purpose wearable patch for measurement and treatment

An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

A wearable patch capable of wireless communications includes an elastic layer, an adhesive layer under the elastic layer, and a shearable electrode layer that includes: a support substrate comprising one or more openings so positioned to allow the shearable electrode layer to be sheared and elongated, and breathable, an upper electrode layer on the support substrate, and a lower electrode layer under the support substrate. The support substrate can include a via that is conductively connected to the upper electrode layer and the lower electrode layer. The lower electrode can be in contact with a user's body and to pick up electric signals from the user's body.

Compliant wearable patch capable of measuring electrical signals

A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

Stretchable wireless device

An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Stretchable electronic patch having a foldable circuit layer

Methods for forming electrically precise capacitors on insulative substrates, and structures formed therefrom

Highly compliant wearable wireless patch having stress-relief capability

An electronic patch includes a first circuit layer comprising a substantially flat first substrate and a first conductive circuit, a second circuit layer comprising a substantially flat second substrate and a second conductive circuit, and an undulated ribbon that connects the first circuit layer and the second circuit layer. The undulated ribbon includes a third conductive circuit that connects the first conductive circuit and the second conductive circuit. An elastic layer encloses the first circuit layer, the second circuit layer, and the undulated ribbons.

Stretchable electronic patch having a circuit layer undulating in the thickness direction

Devices on a diffusion barrier coated metal substrates, and methods of making the same are disclosed. The devices include a metal substrate, a diffusion barrier layer on the metal substrate, one or more insulator layers on the diffusion barrier layer, and an antenna and/or inductor on the one or more insulator layer(s). The method includes forming a diffusion barrier layer on the metal substrate, forming one or more insulator layers on the diffusion barrier layer; and forming an antenna and/or inductor on an uppermost one of the insulator layer(s). The antenna and/or inductor is electrically connected to at least one of the diffusion barrier layer and/or the metal substrate. Such diffusion barrier coated substrates prevent diffusion of metal atoms from the metal substrate into device layers formed thereon.

Diffusion barrier coated substrates and methods of making the same

High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition are disclosed. The method generally includes the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. The methods provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

Methods for forming electrically precise capacitors, and structures formed therefrom

A hybrid memory system is provided that combines the advantages of NAND flash memory devices with the advantages of NOR flashes memory devices. The system includes a NAND flash memory portion to provide mass storage and fast programming/erasure capabilities of conventional NAND flash memory devices. The system further comprises a NOR flash memory portion to provide code storage and fast random reading capabilities of conventional NOR flash memory devices. Accordingly, the hybrid memory system provides both mass storage and code storage along with fast programming/erasure speeds and fast random access speeds.

Growing community of inventors

Cupertino, CA, United States of America

Jiang Li