Boe Technology Group Co., Ltd.

Ordos Yuansheng Optoelectronics Co., Ltd.

Beijing Boe Multimedia Technology Co., Ltd.

K-tronics (suzhou) Technology Co., Ltd.

Jianbin Gao

Xianlei Meng

Yongbo Ju

Wei Liu

Jian Qiao Sun

Huijun Li

Xinbo Zhou

Deshuai Wang

Xiaoguang Chen

Deli Fang

Guangshuai Wang

Jiannan Wang

Zhimin Wang

Jianjun Chen

Xiangkai Shen

Xikang Jin

Pengfei Cui

An array substrate has a display area and a bonding area located on a side of the display area. The array substrate includes a base, a plurality of first transistors, a plurality of conductive pins and a plurality of conductive electrodes. The plurality of first transistors are disposed on a side of the base and located in the display area; a first transistor includes a first gate, a first source and a first drain. The plurality of conductive pins are disposed on the side of the base and located in the bonding area, and are disposed in a same layer as the first gate. The plurality of conductive electrodes are each disposed on a respective one of surfaces of the plurality of conductive pins away from the base.

Array substrate and method for manufacturing the same, and display apparatus

The present disclosure provides a thin-film transistor and a method for manufacturing the same, an array substrate, and a display device. The thin film transistor of the present disclosure include a plurality of insulating layers, among which at least one insulating layer on the low temperature polysilicon layer comprises organic material, so vias could be formed in the organic material by an exposing and developing process, thereby effectively avoiding the over-etching problem of the low temperature polycrystalline silicon layer caused by dry etching process. By adopting the method for manufacturing the film transistors of the present disclosure, the contact area and uniformity of the drain electrode and the low temperature polysilicon material layer can be increased; the conductivity can be improved; and the production cycle of products can be greatly reduced and thereby improving the equipment capacity.

Thin-film transistor and method for manufacturing the same, array substrates, display devices

A backlight module and a display device are provided. The backlight module includes a back plate, a reflector plate provided on a bottom surface of the back plate, and a spacer provided between the bottom surface of the back plate and the reflector plate and configured to keep a certain spacing between the bottom surface of the back plate and the reflector plate. The display device includes the backlight module. The display device has improved display quality.

Backlight module and display device

The present disclosure discloses a display module support frame and a display device. A display module support frame includes a machine support that is detachably connected to a display module. The machine support includes a horizontal supporting beam, two vertical supporting beams and two auxiliary supporting beams. The two vertical supporting beams are parallel, and face to each other. One end of each of the two vertical supporting beams is fixedly connected to the horizontal supporting beam. One end of each of the auxiliary supporting beams is fixedly connected to the horizontal supporting beam, and the other end thereof is fixedly connected to the vertical supporting beam.

Display module support frame and display device

The present subject matter provides a packaging assembly. The packaging assembly includes an inner protection layer which fits and is in contact with a surface of an object to be packaged, and an outer protection layer which covers the inner protection layer. The materials of the outer protection layer and the inner protection layer have different elastic coefficients.

Packaging assembly

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Beijing, China

Jianbin Gao