Corning Incorporated

US Government as Represented by the Secretary of the Army

Jian-Zhi Jay Zhang

Govindarajan Natarajan

Paul John Shustack

Jeffrey John Domey

Matthew Wade Fenton

Ya-Huei Chang

Linda Ruth Pinckney

Indrajit Dutta

Robert Michael Morena

Karl William Koch, Iii

Prantik Mazumder

Steven Alvin Tietje

Marie Jacqueline Monique Comte

Lisa Ann Lamberson

Huan-Hung Sheng

Leonard Charles Dabich, Ii

Jen-Chieh Lin

Carl Cline

Parimal J Patel

Bokyung Kong

Jun Ro Yoon

Jean Marc Galea

Melinda Ann Hourihan

Julia Anne Dorothee Brueckner

An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.

Substrate thinning process using temporary bond with low thickness variation

Embodiments of a glass wafer for semiconductor fabrication processes are described herein. In some embodiments, a glass wafer includes: a glass substrate comprising: a top surface, a bottom surface opposing the top surface, and an edge surface between the top surface and the bottom surface; a first coating disposed atop the glass substrate, wherein the first coating is a doped crystalline silicon coating having a sheet-resistance of 100 to 1,000,000 ohm per square; and a second coating having one or more layers disposed atop the glass substrate, wherein the second coating comprises a silicon containing coating, wherein the glass wafer has an average transmittance (T) of less than 50% over an entire wavelength range of 400 nm to 1000 nm.

Glass wafers for semiconductor device fabrication

Methods of producing a glass article include melting a first glass composition and feeding a second glass composition into the melter. Both glass compositions include the same combination of components but at least one component has a concentration that is different in each. At least three glass articles may be drawn from the melter, including: a first glass article formed from the first glass composition; at least one intermediate glass article composed of neither the first nor the second glass composition; and a final glass article not composed of the first glass composition. The concentration of the at least one component in the intermediate glass article may be between the concentration in the first and second glass compositions. The first glass article and final glass article may have differing values for certain properties, and the intermediate glass article may have an intermediate set of values for the same properties.

Methods for manufacturing glass articles

A glass-ceramic article that includes an article having a glass-ceramic composition, the composition including:

Glass-ceramic articles, compositions, and methods of making the same

Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.

Thin glass or ceramic substrate for silicon-on-insulator technology

A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.

Methods for printing on glass

Methods for printing ink on pre-treated glass substrates

The disclosure is directed to a transparent armor laminate having a glass, glass-ceramic or ceramic strike face layer, one or a plurality of glass, glass-ceramic ('GC'), ceramic ('C') or polymeric (&#x201c;P&#x201d;) backing layer behind the strike face layer, one or a plurality of spall catcher (&#x201c;SC&#x201d;) layers behind the backing layer(s), and a thin cover glass layer laminated to the strike face, the thin layer being the first layer to be impacted by any incoming projectile or debris. The cover glass has a thickness &#x2266;3 mm. In another embodiment the cover glass thickness is &#x2266;1 mm. Additionally, a defrosting/defogging element is laminated between the cover glass and the strike face.

Transparent armor with improved multi-hit performance by use of a thin cover glass

A transparent armor laminate system is described that utilizes a glass-ceramic material as the strike-face material, one or a plurality of intermediate layers, and a backing material. This laminate system offers improved performance with reduced weight over conventional all-glass or all-glass-ceramic transparent armor systems. The glass-ceramic material consists of a glass phase and a crystalline phase, the crystalline phase being selected from a group consisting of beta-quartz, mullite and combinations thereof.

Hybrid laminated transparent armor

The invention is directed to transparent glass-ceramic materials for use in transparent armor systems. Applications include armor systems for ground vehicles and aircraft as well as personal protective equipment. The glass-ceramic materials according to the invention exhibit a ballistic limit vs. areal density line slope of 1.0 or greater, preferably 1.1 or greater and more preferably 1.2 or greater. The crystalline phase of the glass ceramic materials may include &#x3b2;-quartz, spinel, spinel solid solutions, mullite and phases known in the art to be transparent.

Transparent glass-ceramic armor

Growing community of inventors

Ithaca, NY, United States of America

Jian-Zhi Jay Zhang