Shanghai Tianma Micro-electronics Co., Ltd.

Vmware, Inc.

Shenyang Neusoft Medical Systems Co., Ltd.

Semiconductor Manufacturing International (shanghai) Corporation

Shanghai Neusoft Medical Technology Co., Ltd.

Stmicroelectronics R&d (shanghai) Co. Ltd.

Intel Corporation

Tianma Micro-electronics Co., Ltd.

Shanghai Avic Opto Electronics Co., Ltd.

Chengdu Tianma Micro-electronics Co., Ltd.

Shanghai Makesens Energy Storage Technology Co., Ltd.

University of Shanghai for Science and Technology

Shanghai Imilab Technology Co., Ltd.

Shanghai Institutes for Biological Sciences, Cas

Shenyang Sun Bell Com Bio-pharmaceutical Co., Ltd

Jian Zhao

Jin Feng

Guodong Liang

Zhou Huang

Hong Li

Zhaohui Guo

Haitao Zhou

Baowei Xu

Zhidan Su

Guocheng Wu

Nan Li

Xi Wang

Feng Qin

Xiaohe Li

Ling Shen

Hong Zhang

Huijun Jin

Xiao Yan

Yi Jin

Tenggang Lou

Enhai Zhao

Guopeng Zhou

Pei Song

Yuxing Zhang

Changqing Fu

Hangping Wang

Haoxu Hu

Xinying Li

Anran Song

Yongli Qian

Christos Karamanolis

Hong Ding

Shanshan Lou

Ping Liu

Lei Wu

Qiongqin Mao

Jinghua Ni

Xiaohong Chen

Yuqiu Zhao

Xiaoyuan Ding

Gang Pei

Xiangchun Wang

Zonglin Cai

Yi Zhang

Aditya Kotwal

Yizheng Chen

Jiushi Wan

Honglei Zhou

Shaoli Fu

Donghui Han

Ximin Qi

Xianjun Huang

Wadeo Ou

Xiaofei Liang

Yan Ma

Yunkai Wu

Ji Cheng

Bing Luan

Ce Zhang

Xiaoming Hong

Guoying Zhang

Fujun Wang

Xuewei Cao

Longyun Fu

Taozhu Zhang

Hanwen Shan

Xuzhong Yang

Guanzhong Xiong

Yaqin Liao

Aidong Liang

Chunli Ning

A hot-plugging edge computing system includes at least an elastic database, a data processing module, and hot-plugging computing modules. The elastic database is configured to store data through an SSD array with a configurable number of SSDs. The data processing module is connected to the elastic database and each of the hot-plugging computing modules, and controls data storage in the elastic database, monitors and assigns a task to each of the hot-plugging computing modules. Each of the hot-plugging computing modules performs data computing based on the corresponding task assigned by the data processing module, and returns a computing result to the corresponding data processing module.

Hot-plugging edge computing terminal hardware architecture and system

A display panel and a display apparatus are provided in the present disclosure. The display panel includes a control chip in the non-display region on a first side, where the control chip is at least electrically connected to a data line; and along the second direction, the first side is adjacent to the display region; and includes a heating drive element in the non-display region on the first side, where the heating drive element is electrically connected to a heating wiring through a heating bus. The display panel further includes a gate drive element in the non-display region on a second side, where the gate drive element is electrically connected to a gate electrode line and electrically connected to the control chip through a first lead. Along a third direction, the heating bus is not overlapped with the first lead, where the third direction is perpendicular to the substrate.

Display panel and display apparatus

A display panel includes a display area, a non-display area at least partially surrounding the display area, a plurality of heating wires, a first voltage terminal, and a second voltage terminal. The plurality of heating wires are arranged in the display area. The plurality of heating wires extend along a first direction and are arranged along a second direction. The first direction intersects with the second direction. Each heating wire of the plurality of heating wires includes a first signal end and a second signal end. The first signal end and the second signal end of the same heating wire are arranged on a first side of the display area along the first direction. The first voltage terminal and the second voltage terminal are arranged in the non-display area.

Display panel and display device

Provided are a display panel and a manufacturing method thereof. The display panel includes a base material and a first metal layer and a second metal layer which are laminated on the base material in a thickness direction of the display panel. The first metal layer includes first metal lines, the second metal layer includes second metal lines, the first metal lines extend in a first direction, and the second metal lines extend in a second direction, the first direction intersects the second direction. The first metal layer or the second metal layer includes third metal lines, a third metal line includes at least two first segments extending in the first direction and at least two second segments extending in the second direction, and two adjacent first segments are connected by one second segment. The display panel further includes a heating control assembly electrically connected to the third metal lines.

Display panel and manufacturing method thereof

Provided are a display panel and a transfer method. The display panel includes: an array substrate, where the array substrate includes a base substrate, and the base substrate comprises a plurality of sub-pixel setting regions arranged in an array; an insulating layer located on a side of the pixel driving circuit array facing away from the base substrate, where the pixel driving circuit array includes pixel driving circuits arranged in an array; the insulating layer forms accommodating grooves respectively within the plurality of sub-pixel setting regions; and the pixel driving circuits are disposed in one-to-one correspondence with the accommodating grooves; and data lines and heating lines, where each of the data lines is electrically connected to a respective column of pixel driving circuits among a plurality of columns of pixel driving circuits arranged in the array.

Display panel and transfer method

A display panel includes a substrate and heating wires located at least in a display area of the substrate. The heating wires extend along a first direction and are arranged along a second direction. The first direction intersects with the second direction. Each heating wire includes a first signal end and a second signal end. The first signal end and the second signal end of the same heating wire are located on two sides of the same heating wire along the first direction. First signal ends of the plurality of heating wires are located on a first side of the display area along the first direction. Second signal ends of the plurality of heating wires are located on a second side of the display area along the first direction.

An ASIC chip for performing active battery equalization is provided. The ASIC chip for performing active battery equalization includes: a power conversion module, an equalization switch matrix circuit module comprising a power MOS transistor, a switch control module, a temperature protection module, and a communication interface module. By connecting and controlling the above modules, the equalization switch matrix circuit module performs equalization on a battery in the battery pack. That is, the use of the integrated ASIC chip accelerates and facilitates the BMS solution manufacturers adding the active equalization function, and facilitates the BMS Battery management system effectively improving the service performance and life of lithium batteries.

ASIC chip for performing active battery equalization

An adaptive idle detection method determines whether software defined data centers (SDDCs) in a hyperconverged infrastructure (HCI) environment are idle. Idleness may be quantified via a coefficient of variation (CV) against resource usage, so as to adapt the idle detection method to SDDCs with different hardware specifications and workloads. Management overhead may also be filtered out by the idle detection method, and the idle detection method may use idleness scores to further reduce overhead.

Adaptive idle detection in a software-defined data center in a hyper-converged infrastructure

A display panel includes heating lines each including part located in a display region, and a heating bus and a power supply pin located in a non-display region. The heating bus is electrically connected to the power supply pin and the heating lines. The display region includes first and second sub-regions, the heating lines include first and second heating lines. One first heating line is located in the first sub-region. One second heating line is located in the second sub-region. A length of the heating bus connected between one first heating line and the power supply pin is greater than a length of heating bus connected between one second heating line and the power supply pin. An arrangement density of first heating line is greater than that of the second heating line, or a resistance of the first heating line is smaller than that of the second heating line.

A display panel and a display device are provided. The display panel includes a regular display region and an irregular display region. The display panel also includes a first substrate and a second substrate that are disposed opposite to each other, a liquid crystal layer disposed between the first and second substrates, and a heating electrode layer stacked with the liquid crystal layer. In the irregular display region, the heating electrode layer includes a plurality of first heating wires, and each first heating wire is connected between a first electrode wire and a second electrode wire. At least one first heating wire serves as a target heating wire including a first sub-segment and a second sub-segment. The first sub-segment has a resistance per unit length smaller than the second sub-segment, and the first sub-segment is closer to the regular display region than the second sub-segment.

Disclosed is a copper-niobium alloy for a medical biopsy puncture needle. A needle core and/or needle tube of the puncture needle are/is made of the copper-niobium alloy. The copper-chromium alloy includes the following components by mass: 5≤Nb≤15 and the balance of Cu. A copper alloy with designed components is obtained by combining a diamagnetic material Cu with paramagnetic Nb, and compared with existing medical stainless steel and titanium alloy, the copper alloy has greatly reduced magnetic susceptibility, and specifically, the artifact area and volume are also significantly reduced. In addition, the blank of use of the copper alloy in medical biopsy paracentesis is filled.

Copper-niobium alloy for medical biopsy puncture needle

The present application discloses a display device, a method for controlling the display device, and an electronic device. The display device includes: a first panel and a second panel sequentially stacked along a direction opposite to a light-emitting direction, wherein: the first panel includes first sub-pixels, the second panel includes second sub-pixels; each first sub-pixel is provided with a first electrode, the first electrode has a first extension part, and each second sub-pixel is provided with a second electrode, the second electrode has a second extension part; and in the first panel, first extension parts of first electrodes of at least two adjacent first sub-pixels are arranged in different forms; and/or, in the second panel, second extension parts of second electrodes of at least two adjacent second sub-pixels are arranged in different forms.

Display device, method for controlling display device, and electronic device

A display module includes: a heating circuit, a gating circuit and a plurality of heating lines. The heating circuit includes a first type of heating signal output terminal and a second type of heating signal output terminal, and the gating circuit includes a gating unit. The first type of heating signal output terminal is electrically connected to a first type of signal input terminal of the gating unit, and a first type of signal output terminal of the gating unit is electrically connected to a first terminal of a heating line; and/or the second type of heating signal output terminal is electrically connected to a second type of signal input terminal of the gating unit, and a second type of signal output terminal of the gating unit is electrically connected to a second terminal of the heating line.

Display module and heating method thereof

A method is provided for a hyper-converged storage-compute system to implement an active-active failover architecture for providing Internet Small Computer System Interface (iSCSI) target service. The method intelligently selects multiple hosts to become storage nodes that process iSCSI input/output (I/O) for a target. The method further enables iSCSI persistent reservation (PR) to handle iSCSI I/Os from multiple initiators.

Active-active architecture for distributed ISCSI target in hyper-converged storage

Provided are a transfer substrate, a display panel and a transfer method. The transfer substrate includes a plurality of object setting regions arranged in an array, the plurality of object setting regions including n types, where n is a positive integer, and n&#x2265;2. The transfer substrate further includes: a base substrate, and a blocking layer located on a side of the base substrate. The blocking layer forms accommodating grooves respectively within object setting regions. Phase change materials are provided in accommodating grooves of at least (n&#x2212;1) types of object setting regions. The provided transfer substrate has a simple structure and high transfer efficiency.

Transfer substrate, display panel and transfer method

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Shanghai, China

Jian Zhao