Linktel Technologies Co., Ltd.

China Tobacco Hubei Industrial Corporation Limited

Changjiang River Scientific Research Institute, Changjiang Water Resources Commission

Jian Zhang

Linke Li

Xianwen Yang

Tianshu Wu

Xuefeng Lin

Baiquan Hu

Dingkun Hu

Liang Chen

Zhen Li

Yikun Chen

Hao Liu

Chenghao Luo

Jing Feng

Dan Li

Ning Li

Long Huang

Zaiqin Wang

Huaquan Yang

Wei Han

Chengjing Xiao

Tao Wei

Ren Wan

Xiaomei Shao

Lingmin Liao

Da Zhang

Xiaohu Yan

Helin Guan

Bing Wang

Kai Tang

Zean Wang

Embodiments provide a flammable and fire-resistant carbonaceous heat source and a method and a use for the same. In the embodiments, the flammable and fire-resistant carbonaceous heat source of the present disclosure includes flammable carbon, flame-retardant carbon and a binder, wherein, the flame-retardant carbon includes graphite, the binder includes glutinous rice glue, and based on a total weight of the flammable and fire-resistant carbon heat source, a content of the flammable carbon, the flame-retardant carbon and the binder is 40-75 wt %, 10-45 wt % and 3-15 wt %, respectively. The method for preparing the flammable and fire-resistant carbonaceous heat source of the present disclosure includes the following steps: mixing the flammable carbon, the flame-retardant carbon, and the binder in a content ratio; extruding and shaping a resulting mixture; and drying a resulting mixture.

Flammable and fire-resistant carbonaceous heat source, method for preparing same and use thereof

The present invention provides a multichannel parallel light emitting device comprising a semiconductor cooler, a cold surface of the semiconductor cooler completely covers the area of a hot surface, and when the hot surface and the cold surface are horizontally disposed, a horizontal distance is reserved between the edge of the cold surface and the edge of the hot surface, and a positive electrode and a negative electrode are fixed on a second surface of the cold surface. The semiconductor cooler with the above structure is disposed in a sealed BOX of a BOX package, the bottom surface of the inner wall of the BOX package is provided with a groove for mounting a semiconductor cooler, a hot surface of the semiconductor cooler is fixed at the bottom of the groove, an insulating low thermal conductivity sealing ring is disposed between a lower end of a cold surface of the semiconductor cooler and the BOX package, so that the BOX package, the insulating low thermal conductivity sealing ring and the cold surface of the semiconductor cooler form a closed space, so as to achieve the TEC local hermetic effect, a water-proof film is not required for the TEC, and to ensure the TEC can work in a non-hermetic environment.

Multichannel parallel light emitting device

A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

Silicon photonics multi-channel parallel optical component and coupling method thereof

A system and a method of interface communication being compatible with SFP+ optical modules and QSFP+ switch are provided. The system includes an adapter card. The adapter card includes a set of SFP+ golden fingers that comply with the SFP+ protocol, a set of QSFP+ golden fingers that comply with the QSFP+ protocol, and a microcontroller unit. The adapter card communicates with the SFP optical module through the SFP+ golden fingers, and communicates with the QSFP switch through the QSFP+ golden fingers. The microcontroller unit is used to extend and process the pin information in the adapter card, and to convert the two different protocols of SFP+ and QSFP+, so that the module under the SFP+ protocol can respond under the port of QSFP+, so as to realize the data communication between the SFP+ optical module and the QSFP+ switch.

System and method of interface communication compatible with SFP+ optical module and QSFP+ switch

The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing. The present invention adopts a two-section structure, so that the LD chip component and the optical wavelength division multiplexer are independently separated, and the optical signal processing is carried out in two steps, which not only improves the yield, but also facilitates the implementation of the mounting process. By adopting the optical fiber adapter set, the assembly tolerance can be effectively compensated by utilizing the flexibility of the optical fiber, the stress is eliminated, and the problem of light loss of the assembly stress is avoided.

Light emitting assembly and optical module

A package structure for the multi-channel parallel transmission optical device includes a package base, a package cap which is used to form a package shell with the package base, and a plurality of laser generating units that are all mounted on the package base and arranged annularly relative to the axis of the package base. Each laser generating unit is equipped with an optical mirror group to convert the laser emitted by the laser generating unit into the laser beam parallel to the axis of the package base. A converging lens is also configured inside or outside the package shell, or the package cap uses the converging lens as an optical window, and to converge each laser beam into output beam. The optical path design can significantly reduce the device package volume, which correspondingly increases the channel density.

Multi-channel parallel transmission optical device and its package structure

In the technical field of optical communication a multi-path wavelength division multiplexing light receiving component including a substrate placed at the bottom of a housing is provided. The housing and substrate form an installation chamber, and include a light emitting unit, a light de-multiplexing unit, a reflector and a light receiving unit. The light emission unit, the light de-multiplexing unit, the reflector, and the light receiving unit are located inside the installation cavity, and the light emission unit, the light de-multiplexing unit, and the reflector are fixed on the housing, and the light receiving unit is fixed on the substrate. An optical module includes the multiplex wavelength division multiplexing optical receiving component. The length of the light receiving unit is shortened by reflecting an optical signal decomposed by a light de-multiplexing unit, and disposing the light receiving unit integrally below a reflector.

Multi-channel wavelength division multiplexing optical receiving component and optical module

The present invention relates to an all-in-one converter using a low-speed optical module on a high-speed switch. The present invention relates to the field of optical modules in optical communications. It provides a solution of using a 25G optical module on a 100G switch, and simultaneously enabling a 10G optical module to be used on a 40G switch. A first electrical interface of the converter is connected with a 100G/40G switch, which meets the requirements of SFF-8636 protocol and realizes the bidirectional transmission of signals from the switch to the converter. A second electrical interface of the converter is connected with the optical module, which realizes the module's bidirectional transmission from the converter to the optical module. There is a signal conversion circuit inside the converter, which makes the signals of the two electrical interfaces meet the requirements of their respective protocols. An MCU is integrated inside the converter, which can read information of EEPROM inside the module, making the converter more user-friendly.

All-in-one converter using a low-speed optical module on a high-speed switch

The invention provides an optical module including a circuit board, an optical component and an electrical interface, and the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface-emitting laser chip array and a photodetector chip array, and the signal rate transmission chip is electrically connected with the laser driver chip and the transimpedance limiting amplifier chip through the first microstrip line, and the optical component includes an interface end MT ferrule, and a light-emitting ribbon optical cable and a light-receiving ribbon optical cable both connected with the interface end MT ferrule, the light-emitting ribbon optical cable is coupled and aligned with the vertical cavity surface-emitting laser chip array, and the light-receiving ribbon optical cable is coupled and aligned with the photodetector chip array, and the electrical interface includes a gold finger disposed on one side of circuit board. The gold finger and the signal rate transmission chip are electrically connected through the second microstrip line. The present invention achieves a high-density optical package while optimizing the complexity of optical path coupling.

Optical module

The invention relates to the field of optical communication network modules, and provides a 4-channel CWDM QSFP optical module, comprising a QSFP base and four optical transmitting sub-devices. The four optical transmitting sub-devices are mounted on the base in parallel, and there is a gap between each of the optical transmitting sub-devices and the base. The QSFP optical module further includes CWDM optical components for multiplexing 4-channel optical signals emitted by the four optical transmitting sub-devices. The CWDM optical components comprise a single fiber pigtail for transmitting the multiplexed optical signal, the single fiber pigtail being at least partially located in the gap. The 4-channel CWDM QSFP optical module of the invention connects the four optical transmitting sub-devices with the CWDM optical components by a reasonable method of optical fiber winding, thereby solves the problem that it is difficult to achieve single-mode fiber coupling of four LDs in a small space.

Four-channel coarse wavelength division multiplexing QSFP optical module

A coating material, including a bottom layer, a middle layer and a surface layer. The bottom layer is an epoxy mortar having a thickness of between 1 and 3 mm, the middle layer is an epoxy resin adhesive having a thickness of between 0.1 and 0.5 mm, and the surface layer is a nanomaterial-modified polyaspartic having a thickness of between 0.3 and 0.5 mm. The epoxy resin adhesive has a viscosity of between 50 and 200 mPa&#xb7;s.

Abrasion-resistant coating material and method of using the same

The present invention provides a packaging device of single optical multiplexed parallel optical receiver coupling system component, comprising a housing having a transmission function, an adapter component and collimating lens. The upper surface of the housing is provided with a first groove and a second groove, the lower surface of the housing is provided with a third groove. One end of the housing is provided with a through hole which communicates with the first groove. One end of the collimating lens is connected with the adapter component, and the other end of the collimating lens passes through the through hole to the first groove. A first slope and a second slope are respectively provided on the adjacent side wall between the first groove and the second groove. The second slope is provided with a reflective film. The third groove is provided with a lens array having multiple channels. The packaging device by mechanical structure alignment and active coupling method so as to greatly reduce the number of optical elements required to be accurately positioned on the optical path in the parallel transceiver optical module, greatly simplify the optical alignment process, more easily realize mass production of the optical packaging of corresponding products, which reduces the cost of the optical packaging of corresponding products.

Growing community of inventors

Wuhan, China

Jian Zhang