Asml Netherlands B.v.

Apple Inc.

Hermes Microvision Inc.

Dongfang Jingyuan Electron Limited

Jian Zhang

Yixiang Wang

Zhiwen Kang

Ning Ye

Ruslan Salakhutdinov

Jun Jiang

Yi-Xiang Wang

Emilio Parisotto

Devendra Singh Chaplot

Yan E Wang

Siva Chandra Mouli Sivapurapu

Yan Zhao

Qing Chen

Edward S Ahn

Aashi Manglik

Zhaoli Zhang

Weimin Ma

Amritpal Singh Saini

Chih-Yu Jen

Jinmei Yang

Mario J Srouji

Liang Tang

DanJing Huang

Bin-Da Chan

Yan Wang

A charged particle beam system may include a primary source, a secondary source, and a controller. The primary source may be configured to emit a charged particle beam along an optical axis onto a region of a sample. The secondary source may be configured to irradiate the region of the sample. The controller may be configured to control the charged particle beam system to change a parameter of an output of the secondary source. A method of imaging may include emitting a charged particle beam onto a region of a sample, irradiating the region of the sample with a secondary source, and changing a parameter of an output of the secondary source. A method of detecting defects may include inspecting a sample, generating a first defect distribution, and generating a second defect distribution.

Photo-electrical evolution defect inspection

An improved leveling sensor and method for adjusting a sample height in a charged-particle beam inspection system are disclosed. An improved leveling sensor comprises a light source configured to project a first pattern onto a sample and a detector configured to capture an image of a projected pattern after the first pattern is projected on the sample. The first pattern can comprise an irregularity to enable a determination of a vertical displacement of the sample.

Leveling sensor in multiple charged-particle beam inspection

An illumination unit comprising a first electromagnetic wave source including circuitry for outputting a first electromagnetic wave in a first direction to illuminate a first region of a sample; a second electromagnetic wave source including circuitry for outputting a second electromagnetic wave in a second direction substantially opposite to the first direction; and a reflector configured to reflect the second electromagnetic wave substantially in the first direction to illuminate a second region of the sample.

Multi-source illumination unit and method of operating the same

A system and a method for manipulating a beam of an Advanced Charge Controller module in different planes in an e-beam system are provided. Some embodiments of the system include a lens system configured to manipulate a beam in the tangential plane and the sagittal plane such that the beam spot is projected onto the wafer with high luminous energy. Some embodiments of the system include a lens system comprising at least two cylindrical lens.

Beam manipulation of advanced charge controller module in a charged particle system

A sensor may be used to measure a degree of tilt of a sample. The sensor may include an apparatus having a light source, first, second, and third optical elements, a lens, and an aperture. The first optical element may supply light from the light source toward the sample, and may supply light input into the first optical element from the sample toward the second optical element. The second optical element may supply light toward first and second sensing elements. An aperture may be arranged on a focal plane of the lens. A light beam incident on the first sensing element may be a reference beam.

Self-differential confocal tilt sensor for measuring level variation in charged particle beam system

Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

Thermal-aided inspection by advanced charge controller module in a charged particle system

A system and a method for monitoring a beam in an inspection system are provided. The system includes an image sensor configured to collect a sequence of images of a beam spot of a beam formed on a surface, each image of the sequence of images having been collected at a different exposure time of the image sensor, and a controller configured to combine the sequence of images to obtain a beam profile of the beam.

Method and apparatus for monitoring beam profile and power

An inspection apparatus for adjusting a working height for a substrate for multiple target heights is disclosed. The inspection apparatus includes a radiation source configured to provide a radiation beam and a beam splitter configured to split the radiation beam into multiple beamlets that each reflect off a substrate. Each beamlet contains light of multiple wavelengths. The inspection apparatus includes multiple light reflecting components, wherein each light reflecting component is associated with one of the beamlets reflecting off the substrate and is configured to support a different target height for the substrate by detecting a height or a levelness of the substrate based on the beamlet reflecting off the substrate.

Inspection apparatus and method

An objective lens for forming an image of an object. The objective lens includes, sequentially from an image side to an object side, a first lens group having negative refractive power, and a second lens group having positive refractive power.

Optical objective lens

An optical system used in a charged particle beam inspection system. The optical system includes one or more optical lenses, and a compensation lens configured to compensate a drift of a focal length of a combination of the one or more optical lenses from a first medium to a second medium.

Optical system with compensation lens

A method includes determining motion imitation information for causing a system to imitate a physical task using a first machine learning model that is trained using motion information that represents a performance of the physical task, determining a predicted correction based on the motion information and a current state from the system using a second machine learning model that is trained using the motion information, determining an action to be performed by the system based on the motion imitation information and the predicted correction; and controlling motion of the system in accordance with the action.

Learning skills from video demonstrations

An optical height detection system in a charged particle beam inspection system. The optical height detection system includes a projection unit including a modulated illumination source, a projection grating mask including a projection grating pattern, and a projection optical unit for projecting the projection grating pattern to a sample; and a detection unit including a first detection grating mask including a first detection grating pattern, a second detection grating mask including a second detection grating pattern, and a detection optical system for forming a first grating image from the projection grating pattern onto the first detection grating mask and forming a second grating image from the projection grating pattern onto the second detection grating masks. The first and second detection grating patterns at least partially overlap the first and second grating images, respectively.

Optical height detection system

A system and method for advanced charge control of a light beam is provided. The system comprising a laser source comprising a laser diode for emitting a beam and a beam homogenizer to homogenize the emitted beam. The system and methods further comprise a beam shaper configured to shape the emitted beam using an anamorphic prism group and a driver configured to direct the shaped beam to a specified position on a wafer, wherein the laser source, the beam shaper, and the driver are coaxially aligned.

Method and apparatus for an advanced charged controller for wafer inspection

A method includes obtaining, by a motion generator that has been trained to generate torque values for a plurality of joints of a rig associated with a target, a set of parameters associated with a target motion. The method includes, in response to the target motion being a first type of motion, generating a first set of torque values for the plurality of joints based on the set of parameters and a set of previous poses of the target. The method includes, in response to the target motion being a second type of motion, generating a second set of torque values for the plurality of joints based on the set of parameters and the set of previous poses of the target. The method includes triggering a movement of the target in accordance with the first set of torque values or the second set of torque values.

Growing community of inventors

San Jose, CA, United States of America

Jian Zhang