Intel Corporation

Medipurpose Pte Ltd

Globalfoundries Singapore Pte. Ltd.

Tech Semiconductor Singapore Pte Ltd

Jian Sun

Mingqiu Sun

Yuyang Du

Yong Tong Chua

Juan Boon Tan

Premanand Sakarda

Richard Quinzio

Tu Pei Chen

Yew Hoong Phang

Tiow Hee Edmond Tan

Hue Chin Ling

Sebastien Haezebrouck

Hing Ho Au

Nicole Chalhoub

A resistive memory device is provided. The resistive memory device comprises a first electrode and a resistive layer over the first electrode, the resistive layer having a sidewall. A second electrode is over the resistive layer. An insulating liner is formed on the sidewall of the resistive layer. The insulating liner comprises two layers of different dielectric materials.

Dual layer dielectric liner for resistive memory devices

A method and apparatus for cooperative scheduling of virtual machines. An exemplary method includes maintaining a CPU mask by a virtual machine manager, wherein the CPU mask comprises a real-time availability of each of a plurality of physical CPUs (PCPUs). A virtual machine (VM) is allowed to read the CPU mask.

Cooperative scheduling of virtual machines

Various systems and methods for virtual CPU consolidation to avoid physical CPU contention between virtual machines are described herein. A processor system that includes multiple physical processors (PCPUs) includes a first virtual machine (VM) that includes multiple first virtual processors (VCPUs); a second VM that includes multiple second VCPUs; and a virtual machine monitor (VMM) to map individual ones of the first VCPUs to run on at least one of, individual PCPUs of a first subset of the PCPUs and individual PCPUs of a set of PCPUs that includes the first subset of the PCPUs and a second subset of the PCPUs, based at least in part upon compute capacity of the first subset of the PCPUs to run the first VCPUs, and to map individual ones of the second VCPUs to run on individual ones of the second subset of the PCPUs.

Virtual CPU consolidation to avoid physical CPU contention between virtual machines

A medical cutting device is disclosed in which a pivoted element () is actuated by a trigger () and a cutting blade () is attached to the pivoted element () by a flexible connector and cam elements () cause the blade () to move in an essentially parabolic path when making an incision on a patient.

Device for performing an incision

The present invention relates to a device for performing an incision in a region of interest of a patient, said device including a blade portion for providing the incision, said blade attached to a biasing means to enact a vertical force on said blade so that the blade is biased in a retracted position, a triggering means for activating the blade to move from a previously retained pre-operating position, to an operating position where the blade contacts a region of interest of the patient thereby performing an incision, and to a post operating position, a guide means to guide a path of the blade as it moves in an operating position said blade portion adapted to engage said guide means when in an operating position, so that a path of the blade in an operating position is guided, the device further including a housing to house said device, said housing having an elongate slot at one end, where in an operating position, the blade extends therethrough said slot, and in a pre and post operating position, the blade does not extend therethrough said slot, wherein the blade, biasing means and the triggering means are integral to one another, forming a plate.

A thermal activated SACVD method for depositing a phosphorus oxide layer onto a silicon oxide wafer comprising the steps of: loading an SACVD device with a silicon oxide wafer; depositing a phosphorus doped oxide (PSG) layer on the USG layer using pure oxygen and a phosphorus and silicon source; purging the SACVD device; and depositing a boron and phosphorus doped oxide (BPSG) layer on the PSG layer.

Growing community of inventors

Singapore, Singapore

Jian Sun