Semiconductor Technologies & Instruments Pte. Ltd.

Jian Ping Jin

Lee Kwang Heng

Leng Kheam Lee

A wafer table structure providing a single wafer table surface suitable for handling both wafers and film frames includes a base tray having a set of compartments formed therein by way of a set of ridges formed in or on an interior base tray surface; a hardenable fluid permeable compartment material disposed within the set of base tray compartments; and a set of openings formed in the base tray interior surface by which the hardened compartment material is exposable to negative or positive pressures. The base tray includes a first ceramic material (e.g., porcelain), and the hardenable compartment material includes a second ceramic material. The base tray and the compartment material are simultaneously machinable by way of a standard machining process to thereby planarize exposed outer surfaces of the base tray and the hardened compartment material at an essentially identical rate for forming a highly or ultra-planar wafer table surface.

Single ultra-planar wafer table structure for both wafers and film frames

A multifunction wafer and film frame handling system includes a wafer table assembly having a wafer table providing an ultra-planar wafer table surface configured for carrying a wafer or a film frame, and at least one of: a flattening apparatus configured for automatically applying a downward force to portions of a warped or non-planar wafer in a direction normal to the wafer table surface; a displacement limitation apparatus configured for automatically constraining or preventing uncontrolled lateral motion of a wafer relative to the wafer table surface after cessation of an applied negative pressure and application of a positive pressure to the underside of the wafer via the wafer table; and a rotational misalignment compensation apparatus configured for automatically compensating for a rotational misalignment of a wafer mounted on a film frame.

Multifunction wafer and film frame handling system

An end handler and method for processing a device are presented. The end handler includes a mating portion for mating with a tool and a support portion for supporting a film frame on a support surface. The support portion includes a support base section, extension sections extending from the support base section, and vacuum ports on the support surface for facilitating mating of the film frame on the support surface. Each of the vacuum port includes at least one reservoir having at least one vacuum opening in fluid communication with at least one vacuum source. The vacuum ports being configured to principally maintain a slimmest profile with strongest suction force possible.

End handler for film and film frames and a method thereof

A system and method for transferring component panes from a component pane storage station to a vacuum table assembly are disclosed. The system includes a number of component pane handlers, for instance two handlers, and a pick and place mechanism or arm. The handler transfers the component panes from the station to the mechanism. The system includes an alignment module configured to facilitate spatial alignment of the component pane while the component pane is coupled to the handler. The module can be carried by the mechanism. Spatial alignment of the component pane can be substantially completed before transfer of the component pane from the handler to the mechanism. The mechanism includes a set of vacuum elements or pads that enables pick up of the component pane from the handler as well as release and pick up of the component pane at the vacuum table assembly.

System and method using multiple component pane handlers configured to handle and transfer component panes

A component pane handling apparatus configured to handle component panes of multiple different sizes is disclosed. The apparatus includes at least one component pane capture element that can be displaced between a number of different positions, each position corresponding to a particular component pane size. Therefore, the at least one component pane capture element can be positioned to different positions for allowing handling of component panes of corresponding sizes. The apparatus also includes a position alignment mechanism configured to control displacement of the at least one component pane capture element to the different positions. The apparatus can also include one displacement arm coupled to the component pane capture element. The displacement of the component pane capture element can be effectuated by a displacement of at least a portion of the displacement arm. A method for handling component panes of multiple sizes is also included in this disclosure.

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Singapore, Singapore

Jian Ping Jin