Applied Materials, Inc.

Harman International Industires, Inc.

Harman International Industries, Inc.

Jian Kang

Qintao Zhang

Jianjun Ma

Jun-Feng Lu

Xiaopei Huang

Ting Cai

Weiye He

Ma Ning

A method of promoting adhesion between a dielectric layer of a semiconductor device and a metal fill deposited within a trench in the dielectric layer, including performing an ion implantation process wherein an ion beam formed of an ionized dopant species is directed into the trench at an acute angle relative to a top surface of the dielectric layer to form an implantation layer in a sidewall of the trench, and depositing a metal fill in the trench atop an underlying bottom metal layer, wherein the metal fill adheres to the sidewall.

Method for BEOL metal to dielectric adhesion

Method and system for obtaining on-line service are provided. The method may include: a vehicle mounted system sending a first piece of information about its capability and a request for an on-line service to a mobile communication device connected to the vehicle mounted system; and the vehicle mounted system receiving contents of the on-line service from the mobile communication device, where the contents of the on-line service are obtained by processing to match the capability of the vehicle mounted system. Computation load of the vehicle mounted system may be reduced and more utilization may be realized.

Obtaining on-line service

Growing community of inventors

Shanghai, China

Jian Kang