Melexis Technologies Sa

Melexis Technologies Nv

Jian Chen

Robert Racz

Arnaud Laville

Laurent Otte

Appolonius Jacobus Van Der Wiel

Bruno Boury

Eric Lahaye

Orlin Gueorguiev Saradjov

Carl Van Buggenhout

Mathieu Ackermann

Antonio Cacciato

Thomas Freitag

Michael Bender

Antonino Cacciato

Guido Dupont

Matthijs Pardoen

A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.

Stacked die assembly

A circuit for sensing a current comprises a substrate having a first and a second major surface, the second major surface being opposite to the first major surface. At least one magnetic field sensing element is arranged on the first major surface of the substrate and is suitable for sensing a magnetic field caused by a current flow in a current conductor coupled to the second major surface. The substrate also comprises at least one insulation layer, substantially buried between the first major surface and the second major surface of the substrate.

Insulated current sensor

A method of manufacturing a sensor device () comprises providing () a package () having a first die-receiving subframe volume () separated from a second die-receiving subframe volume () by a partition wall (). An elongate sensor element () is disposed () within the package () so as to bridge the first and second subframe volumes () and to overlie the partition wall (). The elongate sensor element () resides substantially in the first subframe volume () and partially in the second subframe volume (). The elongate sensor element () is electrically connected within the second subframe volume ().

Sensor device and method of manufacture

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing and connected to the lead frame. The housing comprising at least two recesses or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted to the support. A component assembly comprising said sensor mounted on a support, the support comprising a plurality of first and second posts and a plurality of electrical contacts. A method of producing said component assembly, comprising the step of arranging said sensor with its elongated leads adjacent the first posts, and arranging its lateral protrusions and/or lateral recesses adjacent the second posts, and connecting the elongated leads to the electrical contacts.

Magnetic sensor component and assembly

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.

A pressure sensor device comprises a device package () arranged to define a cavity () having an opening for fluid communication with an internal volume thereof. The cavity () comprises a side wall (). An elongate pressure sensor element () is provided and has a proximal end () and a distal end (). The side wall () is arranged to hold fixedly the proximal end () of the pressure sensor element () therein so that the pressure sensor element () is cantilever-suspended from the side wall () within the cavity ().

Pressure sensor device and method of sensing pressure

A semiconductor pressure sensor assembly for measuring a pressure of an exhaust gas which contains corrosive components, comprising: a first cavity, a pressure sensor comprising first bondpads for electrical interconnection, a CMOS chip comprising second bondpads for electrical interconnection with the pressure sensor, an interconnection module having electrically conductive paths connected via bonding wires to the pressure sensor and to the CMOS chip; the interconnection module being a substrate with corrosion-resistant metal tracks, wherein the CMOS chip and part of the interconnection module are encapsulated by a plastic package.

Semiconductor pressure sensor for harsh media application

A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

Current sensor and method of making a current sensor

Method of encapsulating a semiconductor structure comprising providing a semiconductor structure comprising an opto-electric element located in a cavity formed between a substrate and a cap layer, the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion on the cap layer; bringing the at least one protrusion of the cap layer in contact with a tool having a flat surface region, and applying a opaque material to the semiconductor structure where it is not in contact with the tool; and removing the tool thereby providing an encapsulated optical semiconductor device having a transparent window integrally formed with the cap layer.

Semiconductor device having a transparent window for passing radiation

The present invention relates to an integrated-LED device having a housing, whereby the housing comprises a multi-LED device comprising a transparent substrate and a plurality of light emitting diodes, LEDs, arranged for emitting light and disposed on said transparent substrate, an integrated circuit in connection with said LEDs and arranged for controlling said LEDs, a base comprising one or more base extensions, on which at least said multi-LED device is mounted, with said one or more base extensions so arranged or so shaped that a first opening is created to let pass LED light emitted through said transparent substrate by said plurality of LEDs.

Integrated LED device

A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.

Growing community of inventors

Heist-op-den-Berg, Belgium

Jian Chen