Intel Corporation

Jiamiao Tang

Shinichi Sakamoto

Henry Xu

Daoqiang Lu

Jiangqi He

Xiang Yin Zeng

Bok Eng Cheah

Yen Hsiang Chew

Kooi Chi Ooi

Jiun Hann Sir

Mostafa Naguib Abdulla

Yong She

Shanggar Periaman

Michael P Skinner

Edward A Zarbock

Junfeng Zhao

Ming Dong Cui

Gregory V Christensen

Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.

Apparatus, system, and method for wireless connection in integrated circuit packages

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.

Flexible system-in-package solutions for wearable devices

A process includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The process includes placing a first die in a first die recess of the first heat spreader, and placing a second die in a second die recess in the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. Thereafter, the process includes separating the first heat spreader and the second heat spreader. A package is achieved by the process, with reduced thicknesses. The package can be disposed onto a mounting substrate. The package can be assembled into a computing system.

Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same

A method includes mating a first heat spreader and a second heat spreader, such that the first heat spreader at a mating surface and second heat spreader at a mating surface become parallel and adjacent. The mated first heat spreader and second heat spreader have at least one convection channel disposed therebetween. A process includes placing a first die in a first die recess of the first heat spreader, and placing a second die on a second die site on the second heat spreader. The process includes reflowing thermal interface material between each die and respective heat spreader. A package is achieved by the method, with reduced thicknesses. The package can be coupled through a bumpless build-up layer. The package can be assembled into a computing system.

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

An integrated circuit with reduced pad capacitance, having a trench formed in the silicon substrate below the pad to reduce the pad capacitance. In another embodiment, an encapsulated air cavity is formed underneath the pad.

Reducing input capacitance of high speed integrated circuits

A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.

Chip-to-chip optical interconnect

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Shanghai, China

Jiamiao Tang