Boe Technology Group Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Jiakai Yang

Hui Li

Yangkun Jing

Guanghe Ma

Liangshi Li

A patch packaging method and device are provided. The method includes sucking, by a suction mechanism, a loaded cover plate; carrying, by the suction mechanism, the cover plate to move in a direction toward a cavity of a patch packaging mechanism, wherein a substrate to be attached with a patch is placed within the cavity; placing, by the suction mechanism, the cover plate into the cavity, wherein the cover plate, the substrate and side walls of the cavity form an enclosed chamber; extracting, by an air-extraction mechanism, air from the enclosed chamber via an air-outlet hole arranged in the side walls; supplying, by a gas-supply mechanism, a light gas having a density lower than that of the air into the enclosed chamber via a gas-inlet hole arranged in the side walls; and pressing, by a pressing mechanism, the enclosed chamber in such a manner that the cover plate is completely pressed onto the substrate after the light gas is extracted.

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Beijing, China

Jiakai Yang