Applied Materials, Inc.

U.S. Department of Energy

Jiajie Cen

Yu Lei

Yi Xu

Da He

Kazuya Daito

Xiaodong Wang

Kevin Kashefi

Yufei Hu

Rongjun Wang

Yixiong Yang

Sahil Patel

Xiangjin Xie

Tsung-Han Yang

Wei Lei

Suhas Bangalore Umesh

Aixi Zhang

Zhimin Qi

Shiyu Yue

Xingyao Gao

Ju Hyun Oh

Zheng Ju

Mengjia Gaowei

John Smedley

John Walsh

John Jay Sinsheimer

A method of pre-cleaning in a semiconductor structure includes performing a plasma pre-treatment process to remove impurities from a surface of a semiconductor structure comprising a metal layer and a dielectric layer, performing a selective etch process to remove molybdenum oxide from a surface of the metal layer, the selective etch process comprising soaking the semiconductor structure in a precursor including molybdenum chloride (MoCl, MoCl) at a temperature of between 250° C. and 350° C., and performing a post-treatment process to remove chlorine residues and by-products of the selective etch process on the surface of the semiconductor structure.

Metal oxide preclean for bottom-up gapfill in MEOL and BEOL

A method of gap filling a feature on a substrate decreases the feature-to-feature gap fill height variation by using a tungsten halide soak treatment. In some embodiments, the method may include heating a substrate to a temperature of approximately 350 degrees Celsius to approximately 450 degrees Celsius, exposing the substrate to a tungsten halide gas at a process pressure of approximately 5 Torr to approximately 25 Torr, soaking the substrate for a soak time of approximately 5 seconds to approximately 60 seconds with the tungsten halide gas, and performing a metal preclean process and a gap fill deposition on a plurality of features on the substrate after soaking of the substrate has completed.

Methods for minimizing feature-to-feature gap fill height variations

One or more embodiments relates to a system and method for growing ultrasmooth and high quantum efficiency photocathodes. The method includes exposing a substrate of Si wafer to an alkali source; controlling co-evaporating growth and co-deposition forming a growth including Te; and monitoring a stoichiometry of the growth, forming the photocathodes.

Co-deposition of cesium telluride photocathode and X-ray fluorescence controller co-deposition of cesium telluride photocathode

Embodiments of the disclosure relate to methods of depositing tungsten. Some embodiments of the disclosure provide methods for depositing tungsten which are performed at relatively low temperatures. Some embodiments of the disclosure provide methods in which the ratio between reactant gasses is controlled. Some embodiments of the disclosure provide selective deposition of tungsten. Some embodiments of the disclosure provide methods for depositing tungsten films at a low temperature with relatively low roughness, stress and impurity levels.

Selective tungsten deposition at low temperatures

Methods and apparatus for processing a substrate are provided herein. For example, a physical vapor deposition processing chamber comprises a chamber body defining a processing volume, a substrate support disposed within the processing volume and comprising a substrate support surface configured to support a substrate, a power supply configured to energize a target for sputtering material toward the substrate, an electromagnet operably coupled to the chamber body and positioned to form electromagnetic filed lines through a sheath above the substrate during sputtering for directing sputtered material toward the substrate, and a controller operably coupled to the physical vapor deposition processing chamber for controlling the electromagnet based on a recipe comprising a pulsing schedule for pulsing the electromagnet during operation to control directionality of ions relative to a feature on the substrate.

Electromagnet pulsing effect on PVD step coverage

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San Jose, CA, United States of America

Jiajie Cen