Intel Corporation

Jia Yan Go

Min Suet Lim

Eng Huat Goh

Jenny Shio Yin Ong

Seok Ling Lim

Tin Poay Chuah

Hoay Tien Teoh

Jeff Ku

Mark Charles Carbone

Jiun Hann Sir

Prakash Kurma Raju

Juha Paavola

Vivek Paranjape

Prasanna Pichumani

Howe Yin Loo

Gavin Sung

Daniel J Ragland

Gustavo Fricke

Arnab Sen

Yew San Lim

Hua Yang

Justin Michael Huttula

Kannan G Raja

Gokul V Subramaniam

Lance Lin

Kathiravan D

Jason Y Jiang

Xiyong Tian

Baomin Liu

Columbia Mishra

Twan Sing Loo

Ruander Cardenas

Christopher M Moore

Hari Shanker Thakur

Evan Piotr Kuklinski

Ritu Bawa

Gerry Juan

Chin Kung Goh

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Javed Shaikh

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Chee Kheong Yoon

Khal Ern See

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

An electronic device may be a first package. The first package may include a first substrate having a first mounting surface. A first die may be coupled to the first mounting surface. A first interconnect region may be laterally spaced from the first die. The first package may be interconnected with a second package. The second package may include a second die coupled to a second mounting surface. Interconnection of the first package with the second package may establish one or more electrical communication pathways between the first package and the second package. The interconnection of the first package with the second package may interconnect the first die with the second die such that the first die and second die are in communication only through the one or more electrical communication pathways.

Electronic device packaging

Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer mounted on a motherboard. The semiconductor package also includes a hole in motherboard (HiMB) that is formed in the motherboard. The semiconductor package has one or more capacitors mounted on an electrical shield. The electrical shield may be embedded in the HiMB of the motherboard. Accordingly, the semiconductor package has capacitors vertically embedded between the electrical shield and the HiMB of the motherboard. The semiconductor package may also have one or more HiMB sidewalls formed on the HiMB, where each of the one or more HiMB sidewalls includes at least one or more plated through holes (PTHs) with an exposed layer. The PTHs may be electrically coupled to the capacitors as the capacitors are vertically embedded between the electrical shield sidewalls and the HiMB sidewalls (i.e., three-dimensional (3D) capacitors).

Three-dimensional decoupling integration within hole in motherboard

Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.

Electromagnetic interference (EMI) shield for circuit card assembly (CCA)

The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.

Electronic assembly that includes a substrate bridge

Interconnects for semiconductor packages are described. An apparatus may comprise a decoupling capacitor on a logic board, and a conductive interconnect element on the logic board, the conductive interconnect element to connect the decoupling capacitor on the logic board to a power conductor comprising a power pad of a semiconductor package, the conductive interconnect element at a different layer than a ground-potential layer of the logic board. Other embodiments are described and claimed.

Interconnects for semiconductor packages

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Kulim, Malaysia

Jia Yan Go