Taiwan Semiconductor Manufacturing Comp. Ltd.

Jia-Xsing Li

Chen-Hua Douglas Yu

Wen-Chih Chiou

Tsang-Jiuh Wu

Yu-Kuang Liao

Ping-Jung Wu

A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.

Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures

Semiconductor device and manufacturing method thereof

Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof

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Hsinchu, Taiwan

Jia-Xsing Li