Memsensing Microsystems Technology Co., Ltd

Memsensing Microsystems (suzhou, China) Co., Ltd.

Memsensing Microsystems Co., Ltd.

Jia-Xin Mei

Gang Li

Wei Hu

Ping Lv

Hong-Yuan Yang

Bin Xiao

Rui-Fen Zhuang

The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S: providing a first chip, wherein the first chip comprises a first substrate, an MEMS component layer formed on the first substrate and comprising a first electrical bonding point disposed on MEMS the component layer; S: providing a second chip with an IC integrated circuit, wherein the second chip comprises a second lead layer and a second electrical bonding point; S: bonding the first electrical bonding point and the second electrical bonding point; S: processing a thinning operation for the bottom surface of the first substrate; and S: forming an electrical connection layer electrically connected to an external circuit on the bottom surface of the first substrate.

Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the same

A method for integrating an IC and a MEMS component includes the following steps: S1) providing a SOI base () having a first area () and a second area (); S2) fabricating an IC on the first area through a standard semiconductor process, and simultaneously forming a metal conductive layer () and a medium insulation layer () extending to the second area; S3) partly removing the medium insulation layer and then further partly removing the silicon component layer so as to form a backplate diagram; S4) depositing a sacrificial layer () above the SOI base; S5) forming a Poly Sil-xGex film () on the sacrificial layer; S6) forming a back cavity (); and S7) eroding the sacrificial layer to form a chamber () in communication with the back cavity. Besides, a chip () fabricated by the above method is also disclosed.

Chip with integrated circuit and micro-silicon condenser microphone integrated on single substrate and method for making the same

A feedback system for identifying an external force, includes an operation plate and a pressure-sensing unit. The pressure-sensing unit includes an elastic member supporting the operation plate and a pressure sensor inside the elastic member. The pressure sensor includes a pressure sensitive film. An inner side of the elastic member is filled with fluid material which acts on the pressure sensitive film. The operation plate is driven by the external force to be slant which extrudes the elastic member to deform so as to change fluid pressure of the fluid material limited in the elastic member, and such change of the fluid pressure can be sensed by the pressure sensitive film of the pressure sensor so as to identify the movement and the intensity of the external force.

Feedback system for identifying movement and intensity of external force

A transverse acoustic wave resonator includes a base, a resonator component, a number of driving electrodes fixed to the base and a number of fixing portions connecting the base and the resonator component. The resonator component is suspended above a top surface of the base and is perpendicular to the base. The driving electrodes are coupling to side surfaces of the resonator component. The resonator component is formed in a shape of an essential regular polygon. The driving electrodes and the resonator component jointly form an electromechanical coupling system for converting capacitance into electrostatic force. Besides, a capacitive-type transverse extension acoustic wave silicon oscillator includes the transverse acoustic wave resonator and a method of fabricating the transverse acoustic wave resonator are also disclosed.

Transverse acoustic wave resonator, oscillator having the resonator and method for making the resonator

A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover.

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Suzhou, China

Jia-Xin Mei