Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Jia Liu

Kota Tokuda

Taichi Okano

Nobuhiro Yamamoto

Toshihiro Tsujimura

Masahiko Hori

Yusuke Imaizumi

Masahide Takazawa

Yoshinari Tamura

Hiroshi Ota

Tatsuo Tonedachi

Motochika Okano

Minoru Takizawa

Kenichi Agawa

Atsushi Kurosu

Daijo Chida

Yasuyuki Fujiwara

Atsushi Tomishima

Hidetoshi Miyahara

Nobuhiro Takazawa

According to one embodiment, a semiconductor device c includes: a package substrate including a base including a mount portion, and terminals; a semiconductor chip including a first pad to which a ground voltage is supplied, a second pad electrically connected to a first terminal among the terminals, and a semiconductor circuit connected to the first and second pads, the semiconductor chip being provided above the mount portion; and a first capacitor chip including a first capacitor unit provided in a silicon substrate, a first node supplied with the ground voltage, and a second node electrically connected to the second pad, the first capacitor chip being provided above the mount portion.

Semiconductor device

A semiconductor package includes a PDA chip, a MOS chip, and a wiring plate including a first principal surface and a second principal surface, the first principal surface being provided with a first rigid plate that is non-conductive and a second rigid plate that is conductive, the PDA chip being fixed to the first rigid plate by using a non-conductive bonding agent, a lower surface terminal of the MOS chip being soldered to the second rigid plate, the second principal surface being provided with an input terminal and an output terminal, the input terminal being electrically connected to the PDA chip, the output terminal being electrically connected to the second rigid plate.

Semiconductor package

According to one embodiment, an isolator includes: a first semiconductor chip; a second semiconductor chip; a first wiring board including a first surface provided thereon with the first semiconductor chip; a second wiring board including a second surface provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board; a third wiring board spaced apart from each of the first and second wiring boards; a first coil on the first surface; a second coil on the second surface; a third coil on a third surface of the third wiring board, the third surface facing the first and second surfaces, the third coil facing the first coil; a fourth coil on the third surface, facing the second coil, and electrically coupled to the third coil; and an insulator provided between the first to fourth coils.

Isolator

A disk device according to one embodiment includes a first conversion device, a second conversion device, an optical waveguide, a first component, and a second component. The first conversion device emits light corresponding to an electric signal. The second conversion device generates an electric signal corresponding to incident light. The optical waveguide includes a first end joined to the first conversion device and a second end joined to the second conversion device, and transmits light emitted from the first conversion device to the second conversion device. The first component is electrically connected to the first conversion device. The second component is electrically connected to the second conversion device, and communicates with the first component through the first conversion device, the optical waveguide, and the second conversion device.

Disk device having components that communicate with each other via conversion devices

According to one embodiment, an isolator includes a first wiring board and a second wiring board. The first wiring board includes a first insulating layer including first and second principal surfaces; a first coil provided on the first principal surface; and a first pad provided on the first principal surface and electrically connected to the first coil. The second wiring board includes a second insulating layer including third and fourth principal surfaces; a second coil provided on the third principal surface; and a second pad provided on the fourth principal surface and electrically connected to the second coil. The first and second coils are arranged in such a manner as to face each other, and an external size of the second wiring board is smaller than an external size of the first wiring board.

According to one embodiment, a semiconductor device includes: a substrate; a first MOSFET and a second MOSFET that are provided on a first surface of the substrate and have sources commonly coupled; a third MOSFET and a fourth. MOSFET that are provided on the first surface of the substrate and have sources commonly coupled; a light receiver that is provided on the first surface of the substrate and is coupled to the first MOSFET, the second MOSFET, the third MOSFET, and the fourth MOSFET; and a light emitter that is provided on the light receiver.

According to one embodiment, a semiconductor device includes: a substrate that has a first surface extending in a first direction and a second direction; a first metal oxide semiconductor field effect transistor (MOSFET) that is provided on the first surface of the substrate; a support base that is provided above the first surface of the substrate and extends in a third direction intersecting the first direction and the second direction; a light receiving element that is in contact with a second surface of the support base facing the first direction; and a light emitting element that is in contact with a third surface of the light receiving element facing the first direction.

A current detection device of an embodiment includes a conductor, a first magnetic field detector, a second magnetic field detector, and a conductive film. The conductor includes a first region, a second region, and a third region connecting an edge of the first region and an edge of the second region. The first magnetic field detector is disposed between the first and second regions. The second magnetic field detector is disposed opposite to the first magnetic field detector with respect to the third region. The conductive film is bonded to a conductor layer including a slit having a width larger than each of widths of magneto-sensitive parts of the first and second magnetic field detectors and covers the slit, the conductor layer being provided between the conductor and each of the first and second magnetic field detectors.

Current detection device

A current sensor of an embodiment includes a U-shaped conductor through which a current flows, a first magnetic field sensor configured to receive a magnetic field generated by the conductor in a first direction, and a second magnetic field sensor configured to receive the magnetic field in a second direction opposite to the first direction.

Current sensor

According to one embodiment, a disk device includes a housing including a hole, a magnetic disk, a control board closing the hole, and an electronic component. The electronic component is mounted on the control board, and assists a control operation for recording and reproducing information on and from the magnetic disk.

Disk device having a control board closing a hole in a housing of the disk device and a communication antenna located inside the control board

A disk device includes a housing having a sidewall, the side wall having a first through-hole; a magnetic disk rotatably disposed in the housing and surrounded by the sidewall in a radial direction; a flexible printed circuit electrically connected to the magnetic disk; an insulator closing the first through-hole; a wireless communication device having a first communication antenna inside the housing; and a control board electrically connected to the flexible printed circuit. The control board is supplied with power from outside of the housing via a first connector, and is configured to receive a write command or a read command via the first communication antenna.

Disk device having an antenna provided in a housing thereof

Provided is a current detection device including a first stacked board; a second stacked board provided on a first region on the first stacked board; a third stacked board provided on a second region on the first stacked board; a magnetic measurement element provided in a third region on the first stacked board, the magnetic element provided between the first region and the second region; and a first coil provided on the magnetic measurement element or below the magnetic measurement element.

According to one embodiment, a disk device includes a housing having a first transmission hole, a magnetic disk, a head, a first sealing material having an inner surface and an outer surface and closing the first transmission hole, and a first wireless power feeding device having a first power feeding antenna. The first power feeding antenna is located mere inward of the housing than the outer surface of the first sealing material, and receives power transmitted through the first sealing material by wireless power feeding.

Drive incorporating wireless components

According to one embodiment, a disk device includes a housing including a sidewall, a magnetic disk, a wireless communication device including a first communication antenna, and a first insulating member. The sidewall includes a first through portion. The first insulating member closes the first through portion. The first communication antenna is located in the first through portion, is disposed spaced from the housing, and wirelessly communicates with an outside of the housing.

Disk device

A chip package according to one embodiment includes a magnetic field sensor and a chip housing. The chip housing is a rectangular parallelepiped body. A solenoid coil is wound around four outer surfaces of the chip housing. The magnetic field sensor is disposed in the chip package. A plurality of first electrode pads connected to the solenoid coil and a plurality of second electrode pads connected to the magnetic field sensor are disposed on one mounting surface.

Growing community of inventors

Yokohama Kanagawa, Japan

Jia Liu